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? mobile amd-k6-2 processor data sheet publication # 21896 rev: e amendment/ 0 issue date: may 2000 preliminary information ?
trademarks amd, the amd logo, k6, 3dnow!, and combinations thereof, and super7 are trademarks, and amd-k6 and risc86 are registered trademarks of advanced micro devices, inc. mmx is a trademark of intel corporation. microsoft, windows, and windows nt are registered trademarks of microsoft corporation. other product names used in this publication are for identification purposes only and may be trademarks of their respective companies. ? 2000 advanced micro devices, inc. all rights reserved. the contents of this document are provided in connection with advanced micro devices, inc. (amd) products. amd makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. no license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. except as set forth in amds standard terms and conditions of sale, amd assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. amds products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of amds product could create a situation where personal injury, death, or severe property or environmental damage may occur. amd reserves the right to discontinue or make changes to its products at any time without notice. preliminary information
contents iii 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information contents revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi about this data sheet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xiii part one mobile amd-k6 ? -2 processor 1 1 mobile amd-k6 ? -2 processor . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 super7? platform initiative . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 super7 platform enhancements: . . . . . . . . . . . . . . . . . . . . . . . . 5 2 internal architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1 introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 mobile amd-k6 ? -2 processor microarchitecture overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 enhanced risc86 ? microarchitecture . . . . . . . . . . . . . . . . . . . 8 2.3 cache, instruction prefetch, and predecode bits . . . . . . . . . 11 cache . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 prefetching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 predecode bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.4 instruction fetch and decode . . . . . . . . . . . . . . . . . . . . . . . . . 13 instruction fetch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 instruction decode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.5 centralized scheduler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2.6 execution units . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 register x and y pipelines . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2.7 branch-prediction logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 branch history table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 branch target cache . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 return address stack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 branch execution unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3 logic symbol diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 4 signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5 mobile amd-k6-2 processor operation . . . . . . . . . . . . . . . . . 37 5.1 process technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 5.2 clock control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 halt state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 stop grant state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
iv contents mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information stop grant inquire state. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 stop clock state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 5.3 system management mode (smm) . . . . . . . . . . . . . . . . . . . . . 42 overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 smm operating mode and default register values . . . . . . . 42 smm state-save area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 smm revision identifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 smm base address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 halt restart slot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 i/o trap dword. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 i/o trap restart slot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 exceptions, interrupts, and debug in smm . . . . . . . . . . . . . . 51 6 signal switching characteristics . . . . . . . . . . . . . . . . . . . . . . . 53 6.1 clk switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . 53 6.2 clock switching characteristics for 100-mhz bus operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 6.3 clock switching characteristics for 66-mhz bus operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 6.4 valid delay, float, setup, and hold timings . . . . . . . . . . . . 55 6.5 output delay timings for 100-mhz bus operation . . . . . . . 56 6.6 input setup and hold timings for 100-mhz bus operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 6.7 output delay timings for 66-mhz bus operation . . . . . . . . 60 6.8 input setup and hold timings for 66-mhz bus operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 6.9 reset and test signal timing . . . . . . . . . . . . . . . . . . . . . . . 64 7 electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 7.1 operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 7.2 absolute ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 7.3 dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 7.4 power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 7.5 power and grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 power connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 decoupling recommendations . . . . . . . . . . . . . . . . . . . . . . . . 77 pin connection requirements . . . . . . . . . . . . . . . . . . . . . . . . . 77 8 thermal design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 8.1 package thermal specifications . . . . . . . . . . . . . . . . . . . . . . . 79 heat dissipation path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 measuring case temperature . . . . . . . . . . . . . . . . . . . . . . . . . 82
contents v 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 9 package specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 9.1 321-pin staggered cpga package specification . . . . . . . . . 83 9.2 360-pin model 8 cbga package specification . . . . . . . . . . . 85 9.3 360-pin cbga mechanical specification . . . . . . . . . . . . . . . . 87 10 pin description diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 10.1 360-pin cbga pin diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . 89 10.2 321-pin cpga pin diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . 91 10.3 pin designations by functional grouping . . . . . . . . . . . . . . . 93 11 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 part two mobile amd-k6-2-p processor 97 12 mobile amd-k6-2-p processor . . . . . . . . . . . . . . . . . . . . . . . . . 99 12.1 super7 platform initiative . . . . . . . . . . . . . . . . . . . . . . . . . . 101 super7 platform enhancements: . . . . . . . . . . . . . . . . . . . . . . 101 13 electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 13.1 operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 13.2 absolute ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 13.3 dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 13.4 power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 13.5 power and grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 power connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 decoupling recommendations . . . . . . . . . . . . . . . . . . . . . . . 110 pin connection requirements . . . . . . . . . . . . . . . . . . . . . . . . 111 14 thermal design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 14.1 package thermal specifications . . . . . . . . . . . . . . . . . . . . . . 113 heat dissipation path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 measuring case temperature . . . . . . . . . . . . . . . . . . . . . . . . 115 15 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 index. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
vi contents mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information
list of figures vii 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information list of figures part one mobile amd-k6 ? -2 processor 1 figure 1. mobile amd-k6 ? -2 processor block diagram. . . . . . . . . . . . . . . 9 figure 2. cache sector organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 3. the instruction buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 4. mobile amd-k6-2 processor decode logic . . . . . . . . . . . . . . . . 14 figure 5. mobile amd-k6-2 processor scheduler . . . . . . . . . . . . . . . . . . . 17 figure 6. register x and y functional units . . . . . . . . . . . . . . . . . . . . . . 19 figure 7. clock control state transitions . . . . . . . . . . . . . . . . . . . . . . . . . 41 figure 8. smm memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 figure 9. clk waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 figure 10. diagrams key . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 figure 11. output valid delay timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 figure 12. maximum float delay timing . . . . . . . . . . . . . . . . . . . . . . . . . . 68 figure 13. input setup and hold timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 figure 14. reset and configuration timing . . . . . . . . . . . . . . . . . . . . . . . . 69 figure 15. tck waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 figure 16. trst# timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 figure 17. test signal timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 figure 18. suggested component placement . . . . . . . . . . . . . . . . . . . . . . . 76 figure 19. thermal model (cbga package) . . . . . . . . . . . . . . . . . . . . . . . . 80 figure 20. power consumption versus thermal resistance . . . . . . . . . . . 80 figure 21. processors heat dissipation path (cbga package) . . . . . . . . 81 figure 22. measuring case temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . 82 figure 23. 321-pin staggered cpga package specification . . . . . . . . . . . 84 figure 24. 360-pin cbga package specification . . . . . . . . . . . . . . . . . . . . 86 figure 25. mobile amd-k6-2 processor ball-side view (cbga) . . . . . . . . 89 figure 26. mobile amd-k6-2 processor top-side view (cbga) . . . . . . . . 90 figure 27. mobile amd-k6-2 processor bottom-side view (cpga) . . . . . 91 figure 28. mobile amd-k6-2 processor top-side view (cpga) . . . . . . . . 92
viii list of figures mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information part two mobile amd-k6-2-p processor 97 figure 29. suggested component placement . . . . . . . . . . . . . . . . . . . . . . 110 figure 30. thermal model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 figure 31. power consumption versus thermal resistance . . . . . . . . . . 114 figure 32. processors heat dissipation path . . . . . . . . . . . . . . . . . . . . . . 115 figure 33. measuring case temperature. . . . . . . . . . . . . . . . . . . . . . . . . . 116
list of tables ix 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information list of tables part one mobile amd-k6 ? -2 processor 1 table 1. execution latency and throughput of execution units . . . . . 18 table 2. input pin types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 table 3. output pin float conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 table 4. input/output pin float conditions. . . . . . . . . . . . . . . . . . . . . . . 35 table 5. test pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 table 6. bus cycle definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 table 7. special cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 table 8. initial state of registers in smm . . . . . . . . . . . . . . . . . . . . . . . . 44 table 9. smm state-save area map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 table 10. smm revision identifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 table 11. i/o trap dword configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 49 table 12. i/o trap restart slot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 table 13. clk switching characteristics for 100-mhz bus operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 table 14. clk switching characteristics for 66-mhz bus operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 table 15. output delay timings for 100-mhz bus operation . . . . . . . . . 56 table 16. input setup and hold timings for 100-mhz bus operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 table 17. output delay timings for 66-mhz bus operation . . . . . . . . . . 60 table 18. input setup and hold timings for 66-mhz bus operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 table 19. reset and configuration signals for 100-mhz bus operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 table 20. reset and configuration signals for 66-mhz bus operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 table 21. tck waveform and trst# timing at 25 mhz . . . . . . . . . . . . . 66 table 22. test signal timing at 25 mhz . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 table 23. operating ranges. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 table 24. absolute ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 table 25. dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 table 26. typical and maximum power dissipation . . . . . . . . . . . . . . . . . 74 table 27. package thermal specifications. . . . . . . . . . . . . . . . . . . . . . . . . 79
x list of tables mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information table 28. 321-pin staggered cpga package specification . . . . . . . . . . . 83 table 29. 360-pin model 8 cbga package specification . . . . . . . . . . . . . 85 table 30. 360-pin cbga mechanical specification . . . . . . . . . . . . . . . . . . 87 table 31. valid ordering part number combinations . . . . . . . . . . . . . . . 95 part two mobile amd-k6-2-p processor 97 table 32. operating ranges. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 table 33. absolute ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 table 34. dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 table 35. power dissipation (2.2 v components) . . . . . . . . . . . . . . . . . . 107 table 36. power dissipation (2.0 v and 2.1 v components) . . . . . . . . . 108 table 37. package thermal specifications. . . . . . . . . . . . . . . . . . . . . . . . 113 table 38. valid ordering part number combinations . . . . . . . . . . . . . . 117
revision history xi 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information revision history date rev description jan 1999 a initial published release. june 1999 b added part 2 which contains information specific to the mobile amd-k6 ? -2-p processor. july 1999 c added two v cc2 decoupling capacitors to the cbga package on figure 18, suggested component placement, on page 76 and to the cpga package on figure 29 on page 110. sept 1999 d added specifications and opns for 433 mhz, 450 mhz, and 475 mhz frequencies in chapter 13, electrical data, chapter 14, thermal design, and chapter 15, ordering information. may 2000 e added specifications and opn for 500 mhz frequency in chapter 13, electrical data, chapter 14, thermal design, and chapter 15, ordering information.
xii revision history mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information
about this data sheet xiii 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information about this data sheet the mobile amd-k6 ? -2 processor data sheet is a supplement to the amd-k6 ? -2 processor data sheet , order# 21850. when combined, the two data sheets provide the complete specification of the mobile amd-k6-2 and mobile amd-k6-2-p processors. the mobile amd-k6 ? -2 processor data sheet is divided into two parts. part one (chapters 1C11) contains information that pertains to the entire mobile amd-k6-2 processor family. part two (chapters 12C15) contains additional information specific to the mobile amd-k6-2-p processor.
xiv about this data sheet mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information
21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information part 1 mobile amd-k6 ? -2 processor data sheet 1 part one mobile amd-k6 -2 processor the mobile amd-k6 ? -2 processor data sheet is a supplement to the amd-k6 ? -2 processor data sheet , order# 21850. when combined, the two data sheets provide the complete specification of the mobile amd-k6-2 and mobile amd-k6-2-p processors. the mobile amd-k6 ? -2 processor data sheet is divided in to two parts. part one (chapters 1C11) contains information that pertains to the entire mobile amd-k6-2 processor family. ?
2 mobile amd-k6 ? -2 processor data sheet part 1 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information
chapter 1 mobile amd-k6 ? -2 processor 3 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 1 mobile amd-k6 ? -2 processor n advanced 6-issue risc86 ? superscalar microarchitecture u ten parallel specialized execution units u multiple sophisticated x86-to-risc86 instruction decoders u advanced two-level branch prediction u speculative execution u out-of-order execution u register renaming and data forwarding u issues up to six risc86 instructions per clock n large on-chip split 64-kbyte level-one (l1) cache u 32-kbyte instruction cache with additional predecode cache u 32-kbyte writeback dual-ported data cache u mesi protocol support n high-performance ieee 754-compatible and 854-compatible floating-point unit n superscalar mmx? unit supports industry-standard mmx instructions n 3dnow!? technology for high-performance multimedia and 3d graphics capabilities n compatible with super7? 100-mhz frontside bus or socket 7 66-mhz notebook design n ceramic ball grid array (cbga) and socket 7-compatible ceramic pin grid array (cpga) package options n industry-standard system management mode (smm) n ieee 1149.1 boundary scan n x86 binary software compatibility n low voltage 0.25-micron process technology the mobile amd-k6 ? -2 processor is amds second generation mobile amd-k6 processor delivering high performance for x86 notebook pc systems. the mobile amd-k6-2 processor is a natural extension of the mobile amd-k6 processor and incorporates the same leading-edge features, including the innovative and efficient risc86 microarchitecture, a large 64-kbyte level-one cache (32-kbyte dual-ported data cache, 32-kbyte instruction cache with predecode data), and a powerful ieee 754-compatible and 854-compatible floating-point execution unit. in addition, the mobile amd-k6-2 processor incorporates a number of new features, including a superscalar mmx unit, support for a 100-mhz frontside bus, and amds innovative 3dnow! technology for high-performance multimedia and 3d graphics operation.
4 mobile amd-k6 ? -2 processor chapter 1 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information the mobile amd-k6-2 processor includes several key features for the mobile market. the processor is implemented using an amd-developed, state-of-the-art low power 0.25-micron process technology. this process technology features a split-plane design that allows the processor core to operate at a lower voltage while the i/o portion operates at the industry-standard 3.3v level. the 0.25-micron process technology with the split-plane voltage design enables the mobile amd-k6-2 processor to deliver excellent portable pc performance solutions while utilizing a lower processor core voltage, which results in lower power consumption and longer battery life. in addition, the mobile amd-k6-2 processor includes the complete industry-standard system management mode (smm), which is critical to system resource and power management. the mobile amd-k6-2 processor also features the industry-standard stop-clock (stpclk#) control circuitry and the halt instruction, both required for implementing the acpi power management specification. finally, the mobile amd-k6-2 processor is offered in either a small, low-profile, lightweight, thermally-efficient, 360-ball ball grid array (cbga) package that enables thin and light system designs, or a standard socket 7-compatible, 321-pin ceramic pin grid array (cpga) package. the mobile amd-k6-2 processors risc86 microarchitecture is a decoupled decode/execution superscalar design that implements state-of-the-art design techniques to achieve leading-edge performance. advanced design techniques implemented in the mobile amd-k6-2 processor include multiple x86 instruction decode, single-clock internal risc operations, ten execution units that support superscalar operation, out-of-order execution, data forwarding, speculative execution, and register renaming. in addition, the processor supports the industrys most advanced branch prediction logic by implementing an 8192-entry branch history table, the industrys only branch target cache, and a return address stack, which combine to deliver better than a 95% prediction rate. these design techniques enable the mobile amd-k6-2 processor to issue, execute, and retire multiple x86 instructions per clock, resulting in excellent scaleable performance. amds 3dnow! technology is an instruction set extension to x86, that includes 21 new instructions to improve 3d graphics operations and other single precision floating- point compute intensive operations. amd has already shipped millions of amd-k6-2 processors with 3dnow! technology for desktop pcs, revolutionizing the 3d experience with up to four times the peak floating-point performance of previous generation solutions. amd is now bringing this advanced capability to notebook computing, working in conjunction with advanced mobile 3d graphic controllers to reach new levels of realism in mobile computing. with support from microsoft ? and the x86 software developer community, a new generation of visually compelling applications is coming to market that support the 3dnow! technology. the mobile amd-k6-2 processor remains pin compatible with existing socket 7 notebook solutions, however for maximum system performance, the processor works optimally in newer super7 designs that incorporate advanced features such as support for the 100-mhz frontside bus and agp graphics.
chapter 1 mobile amd-k6 ? -2 processor 5 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information the mobile amd-k6-2 processor has undergone extensive testing and is compatible with windows ? 98, windows nt ? and other leading operating systems. the mobile amd-k6-2 processor is also compatible with more than 60,000 software applications, including the latest 3dnow! technology and mmx technology software. as the worlds second-largest supplier of processors for the windows environment, amd has shipped more than 50 million microsoft windows compatible processors in the last five years. the mobile amd-k6-2 processor is the next generation in a long line of microsoft windows compatible processors from amd. with its combination of state-of-the-art features, leading-edge performance, high-performance multimedia engine, x86 compatibility, and low-cost infrastructure, the mobile amd-k6-2 processor is the superior choice for portable personal computers. 1.1 super7? platform initiative amd and its industry partners are investing in the future of socket 7 with the new super7 platform initiative. the goal of the initiative is to maintain the competitive vitality of the socket 7 infrastructure through a series of planned enhancements, including the development of an industry-standard 100-mhz processor bus protocol. in addition to the 100-mhz processor bus protocol, the super7 initiative includes the introduction of chipsets that support the agp specification, and support for a backside l2 cache and frontside l3 cache. super7? platform enhancements: n 100-mhz processor bus the mobile amd-k6-2 processor supports a 100-mhz, 800 mbyte/second frontside bus to provide a high-speed interface to super7 platform-based chipsets. the 100-mhz interface to the frontside level 2 (l2) cache and main system memory speeds up access to the frontside cache and main memory by 50 percent over the 66-mhz socket 7 interfaceresulting in a significant increase of 10% in overall system performance. n accelerated graphics port support agp improves the performance of mid-range pcs that have small amounts of video memory on the graphics card. the industry-standard agp specification enables a 133-mhz graphics interface and will scale to even higher levels of performance. n support for backside l2 and frontside l3 cache the super7 platform has the headroom to support higher-performance amd-k6 processors, with clock speeds scaling to 500 mhz and beyond. future versions of the amd-k6 processor are planned to feature a full-speed, on-chip backside 256-kbyte l2 cache designed to deliver new levels of system performance to notebook pc systems. these versions of the processor are also planned to support an optional 100-mhz frontside l3 cache for even higher-performance system configurations.
6 mobile amd-k6 ? -2 processor chapter 1 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information
chapter 2 internal architecture 7 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet confidential - advance 2 internal architecture 2.1 introduction the mobile amd-k6-2 processor implements advanced design techniques known as the risc86 microarchitecture. the risc86 microarchitecture is a decoupled decode/execution design approach that yields superior sixth-generation performance for x86-based software. this chapter describes the techniques used and the functional elements of the risc86 microarchitecture. 2.2 mobile amd-k6 ? -2 processor microarchitecture overview when discussing processor design, it is important to understand the terms architecture , microarchitecture , and design implementation . the term architecture refers to the instruction set and features of a processor that are visible to software programs running on the processor. the architecture determines what software the processor can run. the architecture of the mobile amd-k6-2 processor is the industry-standard x86 instruction set. the term microarchitecture refers to the design techniques used in the processor to reach the target cost, performance, and functionality goals. the mobile amd-k6 family of processors are based on a sophisticated risc core known as the enhanced risc86 microarchitecture. the enhanced risc86 microarchitecture is an advanced, second-order decoupled decode/execution design approach that enables industry-leading performance for x86-based software. the term design implementation refers to the actual logic and circuit designs from which the processor is created according to the microarchitecture specifications.
8 internal architecture chapter 2 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information enhanced risc86 ? microarchitecture the enhanced risc86 microarchitecture defines the characteristics of the amd-k6 family. the innovative risc86 microarchitecture approach implements the x86 instruction set by internally translating x86 instructions into risc86 operations. these risc86 operations were specially designed to include direct support for the x86 instruction set while observing the risc performance principles of fixed length encoding, regularized instruction fields, and a large register set. the enhanced risc86 microarchitecture used in the mobile amd-k6-2 processor enables higher processor core performance and promotes straightforward extensions, such as those added in the current mobile amd-k6-2 processor and those planned for the future. instead of directly executing complex x86 instructions, which have lengths of 1 to 15 bytes, the mobile amd-k6-2 processor executes the simpler and easier fixed-length risc86 operations, while maintaining the instruction coding efficiencies found in x86 programs. the mobile amd-k6-2 processor contains parallel decoders, a centralized risc86 operation scheduler, and ten execution units that support superscalar operationmultiple decode, execution, and retirementof x86 instructions. these elements are packed into an aggressive and highly efficient six-stage pipeline. mobile amd-k6 ? -2 processor block diagram. as shown in figure 1 on page 9, the high-performance, out-of-order execution engine of the mobile amd-k6-2 processor is mated to a split level-one 64-kbyte writeback cache with 32 kbytes of instruction cache and 32 kbytes of data cache. the instruction cache feeds the decoders and, in turn, the decoders feed the scheduler. the icu issues and retires risc86 operations contained in the scheduler. the system bus interface is an industry-standard 64-bit super7 and socket 7 demultiplexed bus. the mobile amd-k6-2 processor combines the latest in processor microarchitecture to provide the highest x86 performance for todays personal computers. the mobile amd-k6-2 processor offers true sixth-generation performance and x86 binary software compatibility.
chapter 2 internal architecture 9 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet confidential - advance figure 1. mobile amd-k6 ? -2 processor block diagram decoders. decoding of the x86 instructions begins when the on-chip instruction cache is filled. predecode logic determines the length of an x86 instruction on a byte-by-byte basis. this predecode information is stored, along with the x86 instructions, in the instruction cache, to be used later by the decoders. the decoders translate on-the-fly, with no additional latency, up to two x86 instructions per clock into risc86 operations. note: in this chapter, clock refers to a processor clock. the mobile amd-k6-2 processor categorizes x86 instructions into three types of decodesshort, long, and vector. the decoders process either two short, one long, or one vector decode at a time. the three types of decodes have the following characteristics: n short decodesx86 instructions less than or equal to seven bytes in length n long decodesx86 instructions less than or equal to 11 bytes in length n vector decodescomplex x86 instructions store unit branch unit store queue instruction control unit scheduler buffer (24 risc86) six risc86 ? operation issue four risc86 decode out-of-order execution engine 32-kbyte level-one dual-port data cache 128-entry dtlb 20-kbyte predecode cache 64-entry itlb multiple instruction decoders x86 to risc86 branch logic (8192-entry bht) (16-entry btc) (16-entry ras) 16-byte fetch load unit predecode logic level-one cache controller fpu 32-kbyte level-one instruction cache register y functional units integer/ multimedia /3dnow! 100 mhz super7 ? bus interface register x functional units integer/ multimedia/3dnow! ? ? ? ?
10 internal architecture chapter 2 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information short and long decodes are processed completely within the decoders. vector decodes are started by the decoders and then completed by fetched sequences from an on-chip rom. after decoding, the risc86 operations are delivered to the scheduler for dispatching to the executions units. scheduler/instruction control unit. the centralized scheduler or buffer is managed by the instruction control unit (icu). the icu buffers and manages up to 24 risc86 operations at a time. this equals from 6 to 12 x86 instructions. this buffer size (24) is perfectly matched to the processors six-stage risc86 pipeline and four risc86-operations decode rate. the scheduler accepts as many as four risc86 operations at a time from the decoders and retires up to four risc86 operations per clock cycle. the icu is capable of simultaneously issuing up to six risc86 operations at a time to the execution units. this consists of the following types of operations: n memory load operation n memory store operation n complex integer, mmx or 3dnow! register operation n simple integer, mmx or 3dnow! register operation n floating-point register operation n branch condition evaluation registers. when managing the 24 risc86 operations, the icu uses 69 physical registers contained within the risc86 microarchitecture. 48 of the physical registers are located in a general register file and are grouped as 24 committed or architectural registers plus 24 rename registers. the 24 architectural registers consist of 16 scratch registers and 8 registers that correspond to the x86 general-purpose registers eax, ebx, ecx, edx, ebp, esp, esi, and edi. there is an analogous set of registers specifically for mmx and 3dnow! operations. there are 9 mmx/3dnow! committed or architectural registers plus 12 mmx/3dnow! rename registers. the 9 architectural registers consist of one scratch register and 8 registers that correspond to the mmx registers (mm0Cmm7). for more detailed information, see the 3dnow!? technology manual , order# 21928. branch logic. the mobile amd-k6-2 processor is designed with highly sophisticated dynamic branch logic consisting of the following:
chapter 2 internal architecture 11 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet confidential - advance n branch history/prediction table n branch target cache n return address stack the mobile amd-k6-2 processor implements a two-level branch prediction scheme based on an 8192-entry branch history table. the branch history table stores prediction information that is used for predicting conditional branches. because the branch history table does not store predicted target addresses, special address alus calculate target addresses on-the-fly during instruction decode. the branch target cache augments predicted branch performance by avoiding a one clock cache-fetch penalty. this specialized target cache does this by supplying the first 16 bytes of target instructions to the decoders when branches are predicted. the return address stack is a unique device specifically designed for optimizing call and return pairs. in summary, the mobile amd-k6-2 processor uses dynamic branch logic to minimize delays due to the branch instructions that are common in x86 software. 3dnow!? technology. amd has taken a lead role in improving the multimedia and 3d capabilities of the x86 processor family with the introduction of 3dnow! technology, which uses a packed, single-precision, floating-point data format and single instruction multiple data (simd) operations based on the mmx technology model. 2.3 cache, instruction prefetch, and predecode bits the writeback level-one cache on the mobile amd-k6-2 processor is organized as a separate 32-kbyte instruction cache and a 32-kbyte data cache with two-way set associativity. the cache line size is 32 bytes and lines are prefetched from main memory using an efficient pipelined burst transaction. as the instruction cache is filled, each instruction byte is analyzed for instruction boundaries using predecoding logic. predecoding annotates information (5 bits per byte) to each instruction byte that later enables the decoders to efficiently decode multiple instructions simultaneously. cache the processor cache design takes advantage of a sectored organization (see figure 2 on page 12). each sector consists of 64 bytes configured as two 32-byte cache lines. the two cache
12 internal architecture chapter 2 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information lines of a sector share a common tag but have separate pairs of mesi (modified, exclusive, shared, invalid) bits that track the state of each cache line. two forms of cache misses and associated cache fills can take placea tag-miss cache fill and a tag-hit cache fill. in the case of a tag-miss cache fill, the miss is due to a tag mismatch, in which case the required cache line is filled from external memory, and the cache line within the sector that was not required is marked as invalid. in the case of a tag-hit cache fill, the address matches the tag, but the requested cache line is marked as invalid. the required cache line is filled from external memory, and the cache line within the sector that is not required remains in the same cache state. prefetching the mobile amd-k6-2 processor conditionally performs cache prefetching which results in the filling of the required cache line first, and a prefetch of the second cache line making up the other half of the sector. from the perspective of the external bus, the two cache-line fills typically appear as two 32-byte burst read cycles occurring back-to-back or, if allowed, as pipelined cycles. the 3dnow! technology includes an instruction called prefetch that allows a cache line to be prefetched into the data cache. for more detailed information, see the 3dnow!? technology manual , order# 21928. predecode bits decoding x86 instructions is particularly difficult because the instructions are variable-length and can be from 1 to 15 bytes long. predecode logic supplies the five predecode bits that are associated with each instruction byte. the predecode bits indicate the number of bytes to the start of the next x86 instruction. the predecode bits are stored in an extended instruction cache alongside each x86 instruction byte as shown in figure 2. the predecode bits are passed with the instruction bytes to the decoders where they assist with parallel x86 instruction decoding. figure 2. cache sector organization tag address cache line 0 byte 31 predecode bits byte 30 predecode bits ........ ........ byte 0 predecode bits mesi bits cache line 1 byte 31 predecode bits byte 30 predecode bits ........ ........ byte 0 predecode bits mesi bits
chapter 2 internal architecture 13 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet confidential - advance 2.4 instruction fetch and decode instruction fetch the processor can fetch up to 16 bytes per clock out of the instruction cache or branch target cache. the fetched information is placed into a 16-byte instruction buffer that feeds directly into the decoders (see figure 3). fetching can occur along a single execution stream with up to seven outstanding branches taken. the instruction fetch logic is capable of retrieving any 16 contiguous bytes of information within a 32-byte boundary. there is no additional penalty when the 16 bytes of instructions lie across a cache line boundary. the instruction bytes are loaded into the instruction buffer as they are consumed by the decoders. although instructions can be consumed with byte granularity, the instruction buffer is managed on a memory-aligned word (two bytes) organization. therefore, instructions are loaded and replaced with word granularity. when a control transfer occurssuch as a jmp instruction the entire instruction buffer is flushed and reloaded with a new set of 16 instruction bytes. figure 3. the instruction buffer 16 instruction bytes plus 16 sets of predecode bits branch-target cache 16 x 16 by tes 2:1 instruction buffer 16 bytes 16 bytes branch target address adders return address stack 16 x 16 bytes 32-kbyte level-one instruction cache fetch unit
14 internal architecture chapter 2 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information instruction decode the mobile amd-k6-2 processor decode logic is designed to decode multiple x86 instructions per clock (see figure 4). the decode logic accepts x86 instruction bytes and their predecode bits from the instruction buffer, locates the actual instruction boundaries, and generates risc86 operations from these x86 instructions. risc86 operations are fixed-length internal instructions. most risc86 operations execute in a single clock. risc86 operations are combined to perform every function of the x86 instruction set. some x86 instructions are decoded into as few as zero risc86 operationsfor instance a nopor one risc86 operationa register-to-register add. more complex x86 instructions are decoded into several risc86 operations. figure 4. mobile amd-k6 ? -2 processor decode logic instruction buffer 4 risc86 operations long decoder short decoder #1 short decoder #2 vector address vector decoder risc86 ? sequencer on-chip rom
chapter 2 internal architecture 15 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet confidential - advance the mobile amd-k6-2 processor uses a combination of decoders to convert x86 instructions into risc86 operations. the hardware consists of three sets of decoderstwo parallel short decoders, one long decoder, and one vector decoder. the two parallel short decoders translate the most commonly-used x86 instructions (moves, shifts, branches, alu, fpu) and the extensions to the x86 instruction set (including mmx and 3dnow! instructions) into zero, one, or two risc86 operations each. the short decoders only operate on x86 instructions that are up to seven bytes long. in addition, they are designed to decode up to two x86 instructions per clock. the commonly-used x86 instructions that are greater than seven bytes but not more than 11 bytes long, and semi-commonly-used x86 instructions that are up to seven bytes long are handled by the long decoder. the long decoder only performs one decode per clock and generates up to four risc86 operations. all other translations (complex instructions, serializing conditions, interrupts and exceptions, etc.) are handled by a combination of the vector decoder and risc86 operation sequences fetched from an on-chip rom. for complex operations, the vector decoder logic provides the first set of risc86 operations and a vector (initial rom address) to a sequence of further risc86 operations. the same types of risc86 operations are fetched from the rom as those that are generated by the hardware decoders. note: although all three sets of decoders are simultaneously fed a copy of the instruction buffer contents, only one of the three types of decoders is used during any one decode clock. the decoders or the on-chip risc86 rom always generate a group of four risc86 operations. for decodes that cannot fill the entire group with four risc86 operations, risc86 nop operations are placed in the empty locations of the grouping. for example, a long-decoded x86 instruction that converts to only three risc86 operations is padded with a single risc86 nop operation and then passed to the scheduler. up to six groups or 24 risc86 operations can be placed in the scheduler at a time. all of the common, and a few of the uncommon, floating-point instructions (also known as esc instructions) are hardware decoded as short decodes. this decode generates a risc86 floating-point operation and, optionally, an associated floating-point load or store operation. floating-point or esc
16 internal architecture chapter 2 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information instruction decode is only allowed in the first short decoder, but non-esc instructions can be decoded simultaneously by the second short decoder along with an esc instruction decode in the first short decoder. all of the mmx and 3dnow! instructions, with the exception of the emms, femms, and prefetch instructions, are hardware decoded as short decodes. the mmx instruction decode generates a risc86 mmx operation and, optionally, an associated mmx load or store operation. a 3dnow! instruction decode generates a risc86 3dnow! operation and, optionally, an associated load or store operation. mmx and 3dnow! instructions can be decoded in either or both of the short decoders. 2.5 centralized scheduler the scheduler is the heart of the mobile amd-k6-2 processor (see figure 5 on page 17). it contains the logic necessary to manage out-of-order execution, data forwarding, register renaming, simultaneous issue and retirement of multiple risc86 operations, and speculative execution. the schedulers buffer can hold up to 24 risc86 operations. this equates to a maximum of 12 x86 instructions. the scheduler can issue risc86 operations from any of the 24 locations in the buffer. when possible, the scheduler can simultaneously issue a risc86 operation to any available execution unit (store, load, branch, register x integer/multimedia, register y integer/multimedia, or floating-point). in total, the scheduler can issue up to six and retire up to four risc86 operations per clock. the main advantage of the scheduler and its operation buffer is the ability to examine an x86 instruction window equal to 12 x86 instructions at one time. this advantage is due to the fact that the scheduler operates on the risc86 operations in parallel and allows the mobile amd-k6-2 processor to perform dynamic on-the-fly instruction code scheduling for optimized execution. although the scheduler can issue risc86 operations for out-of-order execution, it always retires x86 instructions in order.
chapter 2 internal architecture 17 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet confidential - advance figure 5. mobile amd-k6 ? -2 processor scheduler 2.6 execution units the mobile amd-k6-2 processor contains ten parallel execution unitsstore, load, integer x alu, integer y alu, mmx alu (x), mmx alu (y), mmx/3dnow! multiplier, 3dnow! alu, floating-point, and branch condition. each unit is independent and capable of handling the risc86 operations. table 1 on page 18 details the execution units, functions performed within these units, operation latency, and operation throughput. the store and load execution units are two-stage pipelined designs. the store unit performs data writes and register calculation for lea/push. data memory and register writes from stores are available after one clock. store operations are held in a store queue prior to execution. from there, they execute in order. the load unit performs data memory reads. data is available from the load unit after two clocks. risc86 operation buffer risc86 issue buses risc86 #0 risc86 #1 risc86 #2 risc86 #3 centralized risc86 ? operation scheduler from decode logic
18 internal architecture chapter 2 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information the integer x execution unit can operate on all alu operations, multiplies, divides (signed and unsigned), shifts, and rotates. the integer y execution unit can operate on the basic word and doubleword alu operationsadd, and, cmp, or, sub, xor, zero-extend and sign-extend operands. register x and y pipelines the functional units that execute mmx and 3dnow! instructions share pipeline control with the integer x and integer y units. the register x and y functional units are attached to the issue bus for the register x execution pipeline or the issue bus for the register y execution pipeline or both. each register pipeline has dedicated resources that consist of an integer execution unit and an mmx alu execution unit, therefore allowing superscalar operation on integer and mmx instructions. in addition, both the x and y issue buses are connected to the 3dnow! alu, the mmx/3dnow! multiplier and mmx shifter, which allows the appropriate risc86 operation to be issued through either bus. figure 6 on page 19 shows the details of the x and y register pipelines. table 1. execution latency and throughput of execution units functional unit function latency throughput store lea/push, address (pipelined) 1 1 memory store (pipelined) 1 1 load memory loads (pipelined) 2 1 integer x integer alu 1 1 integer multiply 2C3 2C3 integer shift 1 1 multimedia (processes mmx instructions) mmx alu 1 1 mmx shifts, packs, unpack 1 1 mmx multiply 2 1 integer y basic alu (16-bit and 32-bit operands) 1 1 branch resolves branch conditions 1 1 fpu fadd, fsub, fmul 2 2 3dnow! 3dnow! alu 2 1 3dnow! multiply 2 1 3dnow! convert 2 1
chapter 2 internal architecture 19 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet confidential - advance figure 6. register x and y functional units the branch condition unit is separate from the branch prediction logic in that it resolves conditional branches such as jcc and loop after the branch condition has been evaluated. 2.7 branch-prediction logic sophisticated branch logic that can minimize or hide the impact of changes in program flow is designed into the mobile amd-k6-2 processor. branches in x86 code fit into two categoriesunconditional branches, which always change program flow (that is, the branches are always taken) and conditional branches, which may or may not divert program flow (that is, the branches are taken or not-taken). when a conditional branch is not taken, the processor simply continues decoding and executing the next instructions in memory. typical applications have up to 10% of unconditional branches and another 10% to 20% conditional branches. the mobile amd-k6-2 processor branch logic has been designed to handle mmx/ 3dnow! ? ? ? ? multiplier integer x alu mmx ? ? ? ? alu mmx shifter 3dnow! alu mmx alu integer y alu scheduler buffer (24 risc86 ? operations) issue bus for the register x execution pipeline issue bus for the register y execution pipeline
20 internal architecture chapter 2 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information this type of program behavior and its negative effects on instruction execution, such as stalls due to delayed instruction fetching and the draining of the processor pipeline. the branch logic contains an 8192-entry branch history table, a 16-entry by 16-byte branch target cache, a 16-entry return address stack, and a branch execution unit. branch history table the mobile amd-k6-2 processor handles unconditional branches without any penalty by redirecting instruction fetching to the target address of the unconditional branch. however, conditional branches require the use of the dynamic branch-prediction mechanism built into the mobile amd-k6-2 processor. a two-level adaptive history algorithm is implemented in an 8192-entry branch history table. this table stores executed branch information, predicts individual branches, and predicts the behavior of groups of branches. to accommodate the large branch history table, the mobile amd-k6-2 processor does not store predicted target addresses. instead, the branch target addresses are calculated on-the-fly using alus during the decode stage. the adders calculate all possible target addresses before the instructions are fully decoded and the processor chooses which addresses are valid. branch target cache to avoid a one clock cache-fetch penalty when a branch is predicted taken, a built-in branch target cache supplies the first 16 bytes of instructions directly to the instruction buffer (assuming the target address hits this cache). (see figure 3 on page 13.) the branch target cache is organized as 16 entries of 16 bytes. in total, the branch prediction logic achieves branch prediction rates greater than 95%. return address stack the return address stack is a special device designed to optimize call and ret pairs. software is typically compiled with subroutines that are frequently called from various places in a program. this is usually done to save space. entry into the subroutine occurs with the execution of a call instruction. at that time, the processor pushes the address of the next instruction in memory following the call instruction onto the stack (allocated space in memory). when the processor encounters a ret instruction (within or at the end of the subroutine), the branch logic pops the address from the stack and begins fetching from that location. to avoid the latency of main memory accesses during call and ret operations, the return address stack caches the pushed addresses.
chapter 2 internal architecture 21 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet confidential - advance branch execution unit the branch execution unit enables efficient speculative execution. this unit gives the processor the ability to execute instructions beyond conditional branches before knowing whether the branch prediction was correct. the mobile amd-k6-2 processor does not permanently update the x86 registers or memory locations until all speculatively executed conditional branch instructions are resolved. when a prediction is incorrect, the processor backs out to the point of the mispredicted branch instruction and restores all registers. the mobile amd-k6-2 processor can support up to seven outstanding branches.
22 internal architecture chapter 2 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information
chapter 3 logic symbol diagram 23 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 3 logic symbol diagram a20m# a[31:3] ap ads# adsc# apchk# be[7:0]# ahold boff# breq hlda hold d/c# ewbe# lock# m/io# na# scyc w/r# cache# ken# pcd pwt wb/wt# clock bus arbitration clk bf[2:0] tck tdi tdo tms trst# brdy# brdyc# d[63:0] dp[7:0] pchk# eads# hit# hitm# inv ferr# ignne# flush# init intr nmi reset smi# smiact# stpclk# jtag test data and data parity inquire cycles floating-point error handling external interrupts, smm, reset and initialization address and address parity cycle definition and control cache control mobile amd-k6 ? -2 processor voltage detection vcc2det vcc2h/l# note: the voltage detection pins are only supported in the cpga package. they are not supported in the cbga package.
24 logic symbol diagram chapter 3 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information
chapter 4 signal descriptions 25 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 4 signal descriptions signal name pin location cbga/cpga pin attribute name and summary a20m# v09/ak-08 input address bit 20 mask a20m# is used to simulate the behavior of the 8086 when it is running in real mode. the assertion of a20m# causes the processor to force bit 20 of the physical address to 0 prior to accessing the cache or driving out a memory bus cycle. the clearing of address bit 20 maps addresses that wrap above 1 mbyte to addresses below 1 mbyte. a[31:3] see pin designations by functional grouping on page 93. a31-a5: bidirectional a4-a3: output address bus a[31:3] contains the physical address for the current bus cycle. the processor drives addresses on a[31:3] during memory and i/o cycles, and cycle definition information during special bus cycles. the processor samples addresses on a[31:5] during inquire cycles. ads# p03/aj-05 output address strobe the assertion of ads# indicates the beginning of a new bus cycle. the address bus and all cycle definition signals corresponding to this bus cycle are driven valid off the same clock edge as ads#. adsc# w07/am-02 output address strobe copy adsc# has the identical function and timing as ads#. in the event ads# becomes too heavily loaded due to a large fanout in a system, adsc# can be used to split the load across two outputs, which improves timing. ahold h19/v-04 input address hold ahold can be asserted by the system to initiate one or more inquire cycles. to allow the system to drive the address bus during an inquire cycle, the processor floats a[31:3] and ap off the clock edge on which ahold is sampled asserted. the data bus and all other control and status signals remain under the control of the processor and are not floated. ap n02/ak-02 bidirectional address parity ap contains the even parity bit for cache line addresses driven and sampled on a[31:5]. the term even parity means that the total number of 1 bits on ap and a[31:5] is even. (a4 and a3 are not used for the generation or checking of address parity because these bits are not required to address a cache line.)
26 signal descriptions chapter 4 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information apchk# r03/ae-05 output address parity check if the processor detects an address parity error during an inquire cycle, apchk# is asserted for one clock. be[7:0]# see pin designations by functional grouping on page 93. output byte enables be[7:0]# are used by the processor to indicate the valid data bytes during a write cycle and the requested data bytes during a read cycle. the eight byte enables correspond to the eight bytes of the data bus as follows: the byte enables are also used to distinguish between special bus cycles as defined in table 7 on page 36. bf[2:0] see pin designations by functional grouping on page 93. inputs, internal pullups bus frequency bf[2:0] determine the internal operating frequency of the processor. the frequency of the clk input signal is multiplied internally by a ratio determined by the state of these signals as shown below: bf[2:0] have weak internal pullups and default to the 3.5 ratio if left unconnected. signal name pin location cbga/cpga pin attribute name and summary n be7#: d[63:56] n be6#: d[55:48] n be5#: d[47:40] n be4#: d[39:32] n be3#: d[31:24] n be2#: d[23:16] n be1#: d[15:8] n be0#: d[7:0] state of bf[2:0] inputs 100b 101b 111b 010b 000b 001b 011b 110b processor-clock to bus-clock ratio 2.5x 3.0x 3.5x 4.0x 4.5x 5.0x 5.5x 6.0x
chapter 4 signal descriptions 27 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information boff# j18/z-04 input backoff if boff# is sampled asserted, the processor unconditionally aborts any cycles in progress and transitions to a bus hold state by floating the following signals: a[31:3], ads#, adsc#, ap, be[7:0]#, cache#, d[63:0], d/c#, dp[7:0], lock#, m/io#, pcd, pwt, scyc, and w/r#. these signals remain floated until boff# is sampled negated. this allows an alternate bus master or the system to control the bus. brdy# k03/x-04 input, internal pullup burst ready brdy# is asserted to the processor by system logic to indicate either that the data bus is being driven with valid data during a read cycle or that the data bus has been latched during a write cycle. brdy# is also used to indicate the completion of special bus cycles. brdyc# m01/y-03 input, internal pullup burst ready copy brdyc# has the identical function as brdy#. in the event brdy# becomes too heavily loaded due to a large fanout in a system, brdyc# can be used to reduce this loading, which improves timing. in addition, brdyc# is sampled when reset is negated to configure the drive strength of a[20:3], ads#, hitm#, and w/r#. breq w03/aj-01 output bus request breq is asserted by the processor to request the bus in order to complete an internally pending bus cycle. the system logic can use breq to arbitrate among the bus participants. cache# t03/u-03 output cacheable access for reads, cache# is asserted to indicate the cacheability of the current bus cycle. for write cycles, cache# is asserted to indicate the current bus cycle is a modified cache-line writeback. clk w10/ak-18 input clock the clk signal is the bus clock for the processor and is the reference for all signal timings under normal operation. d/c# w04/ak-04 output data/code the processor drives d/c# during a memory bus cycle to indicate whether it is addressing data or executable code. d/c# is also used to define other bus cycles, including interrupt acknowledge and special cycles. signal name pin location cbga/cpga pin attribute name and summary
28 signal descriptions chapter 4 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information d[63:0] see pin designations by functional grouping on page 93. bidirectional data bus d[63:0] represent the processors 64-bit data bus. each of the eight bytes of data that comprise this bus is qualified by a corresponding byte enable. dp[7:0] see pin designations by functional grouping on page 93. bidirectional data parity dp[7:0] are even parity bits for each valid byte of dataas defined by be[7:0]#driven and sampled on the d[63:0] data bus. if the processor detects bad parity on any valid byte of data during a read cycle, pchk# is asserted. the eight data parity bits correspond to the eight bytes of the data bus as follows: for systems that do not support data parity, dp[7:0] should be connected to v cc3 through pullup resistors. eads# u11/am-04 input external address strobe system logic asserts eads# during a cache inquire cycle to indicate that the address bus contains a valid address. ewbe# u03/w-03 input external write buffer empty the system logic can negate ewbe# to the processor to indicate that its external write buffers are full and that additional data cannot be stored at this time. this causes the processor to delay the following activities until ewbe# is sampled asserted: n the commitment of write hit cycles to cache lines in the modified state or exclusive state in the processors cache n the decode and execution of an instruction that follows a currently-executing serializing instruction n the assertion or negation of smiact# n the entering of the halt state and the stop grant state ferr# l03/q-05 output floating-point error the assertion of ferr# indicates the occurrence of an unmasked floating-point exception resulting from the execution of a floating-point instruction. signal name pin location cbga/cpga pin attribute name and summary n dp7: d[63:56] n dp6: d[55:48] n dp5: d[47:40] n dp4: d[39:32] n dp3: d[31:24] n dp2: d[23:16] n dp1: d[15:8] n dp0: d[7:0]
chapter 4 signal descriptions 29 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information flush# u13/an-07 input cache flush in response to sampling flush# asserted, the processor writes back any data cache lines that are in the modified state, invalidates all lines in the instruction and data caches, and then executes a flush acknowledge special cycle. in addition, flush# is sampled when reset is negated to determine if the processor enters tri-state test mode. hit# v08/ak-06 output inquire cycle hit the processor asserts hit# during an inquire cycle to indicate that the cache line is valid within the processors internal instruction or data cache (also known as a cache hit). hitm# u10/al-05 output inquire cycle hit to modified line the processor asserts hitm# during an inquire cycle to indicate that the cache line exists in the processors data cache in the modified state. the processor performs a writeback cycle as a result of this cache hit. hlda p02/aj-03 output hold acknowledge when hold is sampled asserted, the processor completes the current bus cycles, floats the processor bus, and asserts hlda in an acknowledgment that these events have been completed. the following signals are floated when hlda is asserted: a[31:3], ads#, adsc#, ap, be[7:0]#, cache#, d[63:0], d/c#, dp[7:0], lock#, m/io#, pcd, pwt, scyc, and w/r#. hold j07/ab-04 input bus hold request the system logic can assert hold to gain control of the processors bus. when hold is sampled asserted, the processor completes the current bus cycles, floats the processor bus, and asserts hlda in an acknowledgment that these events have been completed. ignne# v12/aa-35 input ignore numeric exception ignne# is used by external logic to control the effect of an unmasked floating-point exception. under certain circumstances, if ignne# is sampled asserted, the processor ignores the floating-point exception. signal name pin location cbga/cpga pin attribute name and summary
30 signal descriptions chapter 4 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information init v15/aa-33 input initialization the assertion of init causes the processor to flush its pipelines, to initialize most of its internal state, and to branch to address ffff_fff0hthe same instruction execution starting point used after reset. unlike reset, the processor preserves the contents of its caches, the floating-point state, the mmx state, model-specific registers, the cd and nw bits of the cr0 register, and other specific internal resources. intr v13/ad-34 input maskable interrupt intr is the systems maskable interrupt input to the processor. when the processor samples and recognizes intr asserted, the processor executes a pair of interrupt acknowledge bus cycles and then jumps to the interrupt service routine specified by the interrupt number that was returned during the interrupt acknowledge sequence. inv t02/u-05 input invalidation request during an inquire cycle, the state of inv determines whether an addressed cache line that is found in the processors instruction or data cache transitions to the invalid state or the shared state. ken# m02/w-05 input cache enable if ken# is sampled asserted, it indicates that the address presented by the processor is cacheable. otherwise, a single-transfer cycle is executed and the processor does not cache the data. ken# is ignored during writebacks. lock# p01/ah-04 output bus lock the processor asserts lock# during a sequence of bus cycles to ensure that the cycles are completed without allowing other bus masters to intervene. m/io# n01/t-04 output memory or i/o the processor drives m/io# during a bus cycle to indicate whether it is addressing the memory or i/o space. m/io# is used to define other bus cycles, including interrupt acknowledge and special cycles. na# t01/y-05 input next address system logic asserts na# to indicate to the processor that it is ready to accept another address pipelined into the previous bus cycle. signal name pin location cbga/cpga pin attribute name and summary
chapter 4 signal descriptions 31 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information nmi v14/ac-33 input non-maskable interrupt when nmi is sampled asserted, the processor jumps to the interrupt service routine defined by interrupt number 02h. unlike the intr signal, software cannot mask the effect of nmi if it is sampled asserted by the processor. pcd u07/ag-05 output page cache disable the processor drives pcd to indicate the operating systems specification of cacheability for the page being addressed. system logic can use pcd to control external caching. pchk# m03/af-04 output parity check the processor asserts pchk# during read cycles if it detects an even parity error on one or more valid bytes of d[63:0] during a read cycle. pwt v07/al-03 output page writethrough the processor drives pwt to indicate the operating systems specification of the writeback state or writethrough state for the page being addressed. pwt, together with wb/wt#, specifies the data cache-line state during cacheable read misses and write hits to shared cache lines. reset h18/ak-20 input reset when the processor samples reset asserted, it immediately flushes and initializes all internal resources and its internal state including its pipelines and caches, the floating-point state, the mmx state, and all registers, and then the processor jumps to address ffff_fff0h to start instruction execution. the signals brdyc# and flush# are sampled during the falling transition of reset to select the drive strength of selected output signals and to invoke the tri-state test mode, respectively. rsvd see pin designations by functional grouping on page 93. reserved reserved signals are a special class of pins on the cpga package that can be treated in one of the following ways: n as no-connect (nc) pins, in which case these pins are left unconnected n as pins connected to the system logic as defined by the industry-standard super7 and socket 7 interface n any combination of nc and socket 7 pins signal name pin location cbga/cpga pin attribute name and summary
32 signal descriptions chapter 4 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information scyc w15/al-17 output split cycle the processor asserts scyc during misaligned, locked transfers on the d[63:0] data bus. smi# u14/ab-34 input, internal pullup system management interrupt the assertion of smi# causes the processor to enter system management mode (smm). upon recognizing smi#, the processor performs the following actions, in the order shown: 1. flushes its instruction pipelines. 2. completes all pending and in-progress bus cycles. 3. acknowledges the interrupt by asserting smiact# after sampling ewbe# asserted (if ewbe# is masked off, then smiact# is not affected by ewbe#). 4. saves the internal processor state in smm memory. 5. disables interrupts. 6. jumps to the entry point of the smm service routine. smiact# u01/ag-03 output system management interrupt active the processor acknowledges the assertion of smi# with the assertion of smiact# to indicate that the processor has entered system management mode (smm). stpclk# k18/v-34 input, internal pullup stop clock the assertion of stpclk# causes the processor to enter the stop grant state, during which the processors internal clock is stopped. from the stop grant state, the processor can subsequently transition to the stop clock state, in which the bus clock clk is stopped. upon recognizing stpclk#, the processor performs the following actions, in the order shown: 1. flushes its instruction pipelines. 2. completes all pending and in-progress bus cycles. 3. acknowledges the stpclk# assertion by executing a stop grant special bus cycle (see table 7 on page 36). 4. stops its internal clock after brdy# of the stop grant special bus cycle is sampled asserted and after ewbe# is sampled asserted (if ewbe# is masked off, then entry into the stop grant state is not affected by ewbe#). 5. enters the stop clock state if the system logic stops the bus clock clk (optional). signal name pin location cbga/cpga pin attribute name and summary
chapter 4 signal descriptions 33 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information tck d18/m-34 input, internal pullup tes t clo ck tck is the clock for boundary-scan testing using the test access port (tap). tdi e17/n-35 input, internal pullup test data input tdi is the serial test data and instruction input for boundary-scan testing using the test access port (tap). tdo d19/n-33 output test data output tdo is the serial test data and instruction output for boundary-scan testing using the test access port (tap). tms e18/p-34 input, internal pullup test mode select tms specifies the test function and sequence of state changes for boundary-scan testing using the test access port (tap). trst# e19/q-33 input, internal pullup test reset the assertion of trst# initializes the test access port (tap) by resetting its state machine to the test-logic-reset state. vcc2det na/al-01 output vcc2 detect vcc2det is tied to v ss (logic level 0) to indicate to the system logic that it must supply the specified dual-voltage requirements to the v cc2 and v cc3 pins. vcc2h/l# na/an-05 output vcc2 high/low vcc2h/l# is tied to v ss (logic level 0) to indicate to the system logic that it must supply the specified processor core voltage to the v cc2 pins. w/r# w05/am-06 output write/read the processor drives w/r# to indicate whether it is performing a write or a read cycle on the bus. in addition, w/r# is used to define other bus cycles, including interrupt acknowledge and special cycles. wb/wt# n03/aa-05 input writeback or writethrough wb/wt#, together with pwt, specifies the data cache-line state during cacheable read misses and write hits to shared cache lines. signal name pin location cbga/cpga pin attribute name and summary
34 signal descriptions chapter 4 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information table 2. input pin types name type note name type note a20m# asynchronous note 1 ignne# asynchronous note 1 ahold synchronous init asynchronous note 2 bf[2:0] synchronous note 4 intr asynchronous note 1 boff# synchronous inv synchronous brdy# synchronous ken# synchronous brdyc# synchronous note 7 na# synchronous clk clock nmi asynchronous note 2 eads# synchronous reset asynchronous note 5, 6 ewbe# synchronous smi# asynchronous note 2 flush# asynchronous note 2, 3 stpclk# asynchronous note 1 hold synchronous wb/wt# synchronous notes: 1. these level-sensitive signals can be asserted synchronously or asynchronously. to be sampled on a specific clock edge, setup and hold times must be met. if asserted asynchronously, they must be asserted for a minimum pulse width of two clocks. 2. these edge-sensitive signals can be asserted synchronously or asynchronously. to be sampled on a specific clock edge, setup a nd hold times must be met. if asserted asynchronously, they must have been negated at least two clocks prior to assertion and must remain asserted at least two clocks. 3. flush# is also sampled during the falling transition of reset and can be asserted synchronously or asynchronously. to be sampled on a specific clock edge, setup and hold times must be met the clock edge before the clock edge on which reset is sampled negated. if asserted asynchronously, flush# must meet a minimum setup and hold time of two clocks relative to the negation of reset. 4. bf[2:0] are sampled during the falling transition of reset. they must meet a minimum setup time of 1.0 ms and a minimum hold time of two clocks relative to the negation of reset. 5. during the initial power-on reset of the processor, reset must remain asserted for a minimum of 1.0 ms after clk and v cc reach specification before it is negated. 6. during a warm reset, while clk and v cc are within their specification, reset must remain asserted for a minimum of 15 clocks prior to its negation. 7. brdyc# is also sampled during the falling transition of reset. if reset is driven synchronously, brdyc# must meet the specifi ed hold time relative to the negation of reset. if asserted asynchronously, brdyc# must meet a minimum setup and hold time of two clocks relative to the negation of reset.
chapter 4 signal descriptions 35 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information table 3. output pin float conditions name floated at: (note 1) note name floated at: (note 1) note a[4:3] hlda, ahold, boff# note 2,3 hlda always driven ads# hlda, boff# note 2 lock# hlda, boff# note 2 adsc# hlda, boff# note 2 m/io# hlda, boff# note 2 apchk# always driven pcd hlda, boff# note 2 be[7:0]# hlda, boff# note 2 pchk# always driven breq always driven pwt hlda, boff# note 2 cache# hlda, boff# note 2 scyc hlda, boff# note 2 d/c# hlda, boff# note 2 smiact# always driven ferr# always driven vcc2det always driven hit# always driven vcc2h/l# always driven hitm# always driven w/r# hlda, boff# note 2 notes: 1. all outputs except vcc2det, vcc2h/l#, and tdo float during tri-state test mode. 2. floated off the clock edge that boff# is sampled asserted and off the clock edge that hlda is asserted. 3. floated off the clock edge that ahold is sampled asserted. table 4. input/output pin float conditions name floated at: (note 1) note a[31:5] hlda, ahold, boff# note 2,3 ap hlda, ahold, boff# note 2,3 d[63:0] hlda, boff# note 2 dp[7:0] hlda, boff# note 2 notes: 1. all outputs except vcc2det and tdo float during tri-state test mode. 2. floated off the clock edge that boff# is sampled asserted and off the clock edge that hlda is asserted. 3. floated off the clock edge that ahold is sampled asserted. table 5. test pins name type note tck clock tdi input sampled on the rising edge of tck tdo output driven on the falling edge of tck tms input sampled on the rising edge of tck trst# input asynchronous (independent of tck)
36 signal descriptions chapter 4 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information table 6. bus cycle definition bus cycle initiated generated by cpu generated by system logic m/io# d/c# w/r# cache# ken# code read, instruction cache line fill 1 0 0 0 0 code read, noncacheable 1 0 0 1 x code read, noncacheable 1 0 0 x 1 encoding for special cycle 001 1 x interrupt acknowledge 0 0 0 1 x i/o read 0 1 0 1 x i/o write 0 1 1 1 x memory read, data cache line fill 1 1 0 0 0 memory read, noncacheable 1 1 0 1 x memory read, noncacheable 1 1 0 x 1 memory write, data cache writeback 1 1 1 0 x memory write, noncacheable 1 1 1 1 x note: x means dont care table 7. special cycles special cycle a4 be7# be6# be5# be4# be3# be2# be1# be0# m/io# d/c# w/r# cache# ken# stop grant 111111011 0 0 1 1 x flush acknowledge (flush# sampled asserted) 011101111 0 0 1 1 x writeback (wbinvd instruction) 011110111 0 0 1 1 x halt 011111011 0 0 1 1 x flush (invd, wbinvd instruction) 011111101 0 0 1 1 x shutdown 011111110 0 0 1 1 x note: x means dont care
chapter 5 mobile amd-k6 ? -2 processor operation 37 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 5 mobile amd-k6 ? -2 processor operation 5.1 process technology the mobile amd-k6-2 processor is implemented using an advanced cmos process technology that utilizes a split core and i/o voltage supply, which allows the core of the processor to operate at a low voltage while the i/o portion operates at the industry-standard 3.3 volts. this technology enables high performance while reducing power consumption by operating the core at a low voltage and limiting power requirements to the acceptable levels for todays mobile pcs. 5.2 clock control the mobile amd-k6-2 processor supports five modes of clock control. the processor can transition between these modes to maximize performance, to minimize power dissipation, or to provide a balance between performance and power. (see power dissipation on page 74 for the maximum power dissipation of the mobile amd-k6-2 within the normal and reduced-power states.) the five clock-control states supported are as follows: n normal state : the processor is running in real mode, virtual-8086 mode, protected mode, or system management mode (smm). in this state, all clocks are running including the external bus clock clk and the internal processor clockand the full features and functions of the processor are available. n halt state : this low-power state is entered following the successful execution of the hlt instruction. during this state, the internal processor clock is stopped. n stop grant state : this low-power state is entered following the recognition of the assertion of the stpclk# signal. during this state, the internal processor clock is stopped. n stop grant inquire state : this state is entered from the halt state and the stop grant state as the result of a system-initiated inquire cycle. n stop clock state : this low-power state is entered from the stop grant state when the clk signal is stopped.
38 mobile amd-k6 ? -2 processor operation chapter 5 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information the following sections describe each of the four low-power states. figure 7 on page 41 illustrates the clock control state transitions. halt state enter halt state. during the execution of the hlt instruction, the mobile amd-k6-2 processor executes a halt special cycle. after brdy# is sampled asserted during this cycle, and then ewbe# is also sampled asserted (if not masked off), the processor enters the halt state in which the processor disables most of its internal clock distribution. in order to support the following operations, the internal phase-lock loop (pll) continues to run, and some internal resources are still clocked in the halt state: n inquire cycles: the processor continues to sample ahold, boff#, and hold in order to support inquire cycles that are initiated by the system logic. the processor transitions to the stop grant inquire state during the inquire cycle. after returning to the halt state following the inquire cycle, the processor does not execute another halt special cycle. n flush cycles: the processor continues to sample flush#. if flush# is sampled asserted, the processor performs the flush operation in the same manner as it is performed in the normal state. upon completing the flush operation, the processor executes the halt special cycle which indicates the processor is in the halt state. n time stamp counter (tsc): the tsc continues to count in the halt state. n signal sampling: the processor continues to sample init, intr, nmi, reset, and smi#. after entering the halt state, all signals driven by the processor retain their state as they existed following the completion of the halt special cycle. exit halt state. the mobile amd-k6-2 processor remains in the halt state until it samples init, intr (if interrupts are enabled), nmi, reset, or smi# asserted. if any of these signals is sampled asserted, the processor returns to the normal state and performs the corresponding operation. all of the normal requirements for recognition of these input signals apply within the halt state.
chapter 5 mobile amd-k6 ? -2 processor operation 39 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information stop grant state enter stop grant state. after recognizing the assertion of stpclk#, the mobile amd-k6-2 processor flushes its instruction pipelines, completes all pending and in-progress bus cycles, and acknowledges the stpclk# assertion by executing a stop grant special bus cycle. after brdy# is sampled asserted during this cycle, and after ewbe# is also sampled asserted (if not masked off), the processor enters the stop grant state. the stop grant state is like the halt state in that the processor disables most of its internal clock distribution in the stop grant state. in order to support the following operations, the internal pll still runs, and some internal resources are still clocked in the stop grant state: n inquire cycles: the processor transitions to the stop grant inquire state during an inquire cycle. after returning to the stop grant state following the inquire cycle, the processor does not execute another stop grant special cycle. n time stamp counter (tsc): the tsc continues to count in the stop grant state. n signal sampling: the processor continues to sample init, intr, nmi, reset, and smi#. flush# is not recognized in the stop grant state (unlike while in the halt state). upon entering the stop grant state, all signals driven by the processor retain their state as they existed following the completion of the stop grant special cycle. exit stop grant state. the mobile amd-k6-2 processor remains in the stop grant state until it samples stpclk# negated or reset asserted. if stpclk# is sampled negated, the processor returns to the normal state in less than 10 bus clock (clk) periods. after the transition to the normal state, the processor resumes execution at the instruction boundary on which stpclk# was initially recognized. if stpclk# is recognized as negated in the stop grant state and subsequently sampled asserted prior to returning to the normal state, a minimum of one instruction is executed prior to re-entering the stop grant state. if init, intr (if interrupts are enabled), flush#, nmi, or smi# are sampled asserted in the stop grant state, the processor latches the edge-sensitive signals (init, flush#,
40 mobile amd-k6 ? -2 processor operation chapter 5 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information nmi, and smi#), but otherwise does not exit the stop grant state to service the interrupt. when the processor returns to the normal state due to sampling stpclk# negated, any pending interrupts are recognized after returning to the normal state. to ensure their recognition, all of the normal requirements for these input signals apply within the stop grant state. if reset is sampled asserted in the stop grant state, the processor immediately returns to the normal state and the reset process begins. stop grant inquire state enter stop grant inquire state. the stop grant inquire state is entered from the stop grant state or the halt state when eads# is sampled asserted during an inquire cycle initiated by the system logic. the mobile amd-k6-2 processor responds to an inquire cycle in the same manner as in the normal state by driving hit# and hitm#. if the inquire cycle hits a modified data cache line, the processor performs a writeback cycle. exit stop grant inquire state. following the completion of any writeback, the processor returns to the state from which it entered the stop grant inquire state. stop clock state enter stop clock state. if the clk signal is stopped while the mobile amd-k6-2 processor is in the stop grant state, the processor enters the stop clock state. because all internal clocks and the pll are not running in the stop clock state, the stop clock state represents the minimum-power state of all clock control states. the clk signal must be held low while it is stopped. the stop clock state cannot be entered from the halt state. intr is the only input signal that is allowed to change states while the processor is in the stop clock state. however, intr is not sampled until the processor returns to the stop grant state. all other input signals must remain unchanged in the stop clock state. exit stop clock state. the mobile amd-k6-2 processor returns to the stop grant state from the stop clock state after the clk signal is started and the internal pll has stabilized. pll stabilization is achieved after the clk signal has been running within its specification for a minimum of 1.0 ms.
chapter 5 mobile amd-k6 ? -2 processor operation 41 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information the frequency of clk when exiting the stop clock state can be different than the frequency of clk when entering the stop clock state. the state of the bf[2:0] signals when exiting the stop clock state is ignored because the bf[2:0] signals are only sampled during the falling transition of reset. figure 7. clock control state transitions eads# asserted eads# asserted hlt instruction stop grant state normal mode C real C virtual-8086 C protected C smm halt state stop clock state reset, smi#, init, or intr asserted stop grant inquire state stpclk# asserted stpclk# negated, or reset asserted clk started clk stopped writeback completed writeback completed
42 mobile amd-k6 ? -2 processor operation chapter 5 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information 5.3 system management mode (smm) overview smm is an alternate operating mode entered by way of a system management interrupt (smi) and handled by an interrupt service routine. smm is designed for system control activities such as power management. these activities appear transparent to conventional operating systems like dos and windows. smm is primarily targeted for use by the basic input output system (bios) and specialized low-level device drivers. the code and data for smm are stored in the smm memory area, which is isolated from main memory. the processor enters smm by the system logics assertion of the smi# interrupt and the processors acknowledgment by the assertion of smiact#. at this point the processor saves its state into the smm memory state-save area and jumps to the smm service routine. the processor returns from smm when it executes the rsm (resume) instruction from within the smm service routine. subsequently, the processor restores its state from the smm save area, negates smiact#, and resumes execution with the instruction following the point where it entered smm. the following sections summarize the smm state-save area, entry into and exit from smm, exceptions and interrupts in smm, memory allocation and addressing in smm, and the smi# and smiact# signals. smm operating mode and default register values the software environment within smm has the following characteristics: n addressing and operation in real mode n 4-gbyte segment limits n default 16-bit operand, address, and stack sizes, although instruction prefixes can override these defaults n control transfers that do not override the default operand size truncate the eip to 16 bits n far jumps or calls cannot transfer control to a segment with a base address requiring more than 20 bits, as in real mode segment-base addressing n a20m# is masked n interrupt vectors use the real-mode interrupt vector table n the if flag in eflags is cleared (intr not recognized)
chapter 5 mobile amd-k6 ? -2 processor operation 43 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information n the tf flag in eflags is cleared n the nmi and init interrupts are disabled n debug register dr7 is cleared (debug traps disabled) figure 8 shows the default map of the smm memory area. it consists of a 64-kbyte area, between 0003_0000h and 0003_ffffh, of which the top 32 kbytes (0003_8000h to 0003_ffffh) must be populated with ram. the default code-segment (cs) base address for the areacalled the smm base addressis at 0003_0000h. the top 512 bytes (0003_fe00h to 0003_ffffh) contain a fill-down smm state-save area. the default entry point for the smm service routine is 0003_8000h. figure 8. smm memory smm state-save area smm base address (cs) service routine entry point fill down smm service routine 32-kbyte minimum ram 0003_8000h 0003_fe00h 0003_ffffh 0003_0000h
44 mobile amd-k6 ? -2 processor operation chapter 5 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information table 8 shows the initial state of registers when entering smm. smm state-save area when the processor acknowledges an smi# interrupt by asserting smiact#, it saves its state in a 512-byte smm state-save area shown in table 9. the save begins at the top of the smm memory area (smm base address + ffffh) and fills down to smm base address + fe00h. table 9 shows the offsets in the smm state-save area relative to the smm base address. the smm service routine can alter any of the read/write values in the state-save area. table 8. initial state of registers in smm registers smm initial state general purpose registers unmodified eflags 0000_0002h cr0 pe, em, ts, and pg are cleared (bits 0, 2, 3, and 31). the other bits are unmodified. dr7 0000_0400h gdtr, ldtr, idtr, tssr, dr6 unmodified eip 0000_8000h cs 0003_0000h ds, es, fs, gs, ss 0000_0000h table 9. smm state-save area map address offset contents saved fffch cr0 fff8h cr3 fff4h eflags fff0h eip ffech edi ffe8h esi ffe4h ebp ffe0h esp ffdch ebx ffd8h edx notes: no data dump at that address * only contains information if smi# is asserted during a valid i/o bus cycle.
chapter 5 mobile amd-k6 ? -2 processor operation 45 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information ffd4h ecx ffd0h eax ffcch dr6 ffc8h dr7 ffc4h tr ffc0h ldtr base ffbch gs ffb8h fs ffb4h ds ffb0h ss ffach cs ffa8h es ffa4h i/o trap dword ffa0h ff9ch i/o trap eip* ff98h ff94h ff90h idt base ff8ch idt limit ff88h gdt base ff84h gdt limit ff80h tss attr ff7ch tss base ff78h tss limit ff74h ff70h ldt high ff6ch ldt low ff68h gs attr ff64h gs base ff60h gs limit ff5ch fs attr table 9. smm state-save area map (continued) address offset contents saved notes: no data dump at that address * only contains information if smi# is asserted during a valid i/o bus cycle.
46 mobile amd-k6 ? -2 processor operation chapter 5 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information ff58h fs base ff54h fs limit ff50h ds attr ff4ch ds base ff48h ds limit ff44h ss attr ff40h ss base ff3ch ss limit ff38h cs attr ff34h cs base ff30h cs limit ff2ch es attr ff28h es base ff24h es limit ff20h ff1ch ff18h ff14h cr2 ff10h cr4 ff0ch i/o restart esi* ff08h i/o restart ecx* ff04h i/o restart edi* ff02h halt restart slot ff00h i/o trap restart slot fefch smm revid fef8h smm base fef7hCfe00h table 9. smm state-save area map (continued) address offset contents saved notes: no data dump at that address * only contains information if smi# is asserted during a valid i/o bus cycle.
chapter 5 mobile amd-k6 ? -2 processor operation 47 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information smm revision identifier the smm revision identifier at offset fefch in the smm state-save area specifies the version of smm and the extensions that are available on the processor. the smm revision identifier fields are as follows: n bits 31C18 reserved n bit 17 smm base address relocation (1 = enabled) n bit 16 i/o trap restart (1 = enabled) n bits 15C0 smm revision level for the mobile amd-k6-2 processor = 0002h table 10 shows the format of the smm revision identifier. smm base address during reset, the processor sets the base address of the code-segment (cs) for the smm memory areathe smm base addressto its default, 0003_0000h. the smm base address at offset fef8h in the smm state-save area can be changed by the smm service routine to any address that is aligned to a 32-kbyte boundary. (locations not aligned to a 32-kbyte boundary cause the processor to enter the shutdown state when executing the rsm instruction.) in some operating environments it may be desirable to relocate the 64-kbyte smm memory area to a high memory area in order to provide more low memory for legacy software. during system initialization, the base of the 64-kbyte smm memory area is relocated by the bios. to relocate the smm base address, the system enters the smm handler at the default address. this handler changes the smm base address location in the smm state-save area, copies the smm handler to the new location, and exits smm. the next time smm is entered, the processor saves its state at the new base address. this new address is used for every smm entry until the smm base address in the smm state-save area is changed or a hardware reset occurs. table 10. smm revision identifier 31C18 17 16 15C0 reserved smm base relocation i/o trap extension smm revision level 0 1 1 0002h
48 mobile amd-k6 ? -2 processor operation chapter 5 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information halt restart slot during entry into smm, the halt restart slot at offset ff02h in the smm state-save area indicates if smm was entered from the halt state. before returning from smm, the halt restart slot (offset ff02h) can be written to by the smm service routine to specify whether the return from smm takes the processor back to the halt state or to the next instruction after the hlt instruction. upon entry into smm, the halt restart slot is defined as follows: n bits 15C1 reserved n bit 0 point of entry to smm: 1 = entered from halt state 0 = not entered from halt state after entry into the smi handler and before returning from smm, the halt restart slot can be written using the following definition: n bits 15C1 reserved n bit 0 point of return when exiting from smm: 1 = return to halt state 0 = return to next instruction after the hlt instruction if the return from smm takes the processor back to the halt state, the hlt instruction is not re-executed, but the halt special bus cycle is driven on the bus after the return. i/o trap dword if the assertion of smi# is recognized during the execution of an i/o instruction, the i/o trap dword at offset ffa4h in the smm state-save area contains information about the instruction. the fields of the i/o trap dword are configured as follows: n bits 31C16 i/o port address n bits 15C4 reserved n bit 3 rep (repeat) string operation (1 = rep string, 0 = not a rep string) n bit 2 i/o string operation (1 = i/o string, 0 = not a i/o string) n bit 1 valid i/o instruction (1 = valid, 0 = invalid) n bit 0 input or output instruction (1 = inx, 0 = outx)
chapter 5 mobile amd-k6 ? -2 processor operation 49 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information table 11 shows the format of the i/o trap dword. the i/o trap dword is related to the i/o trap restart slot (see i/o trap restart slot on page 49). if bit 1 of the i/o trap dword is set by the processor, it means that smi# was asserted during the execution of an i/o instruction. the smi handler tests bit 1 to see if there is a valid i/o instruction trapped. if the i/o instruction is valid, the smi handler is required to ensure the i/o trap restart slot is set properly. the i/o trap restart slot informs the cpu whether it should re-execute the i/o instruction after the rsm or execute the instruction following the trapped i/o instruction. note: if smi# is sampled asserted during an i/o bus cycle a mini- mum of three clock edges before brdy # is sampled asserted, the associated i/o instruction is guaranteed to be trapped by the smi handler. i/o trap restart slot the i/o trap restart slot at offset ff00h in the smm state-save area specifies whether the trapped i/o instruction should be re-executed on return from smm. this slot in the state-save area is called the i/o instruction restart function. re-executing a trapped i/o instruction is useful, for example, if an i/o write occurs to a disk that is powered down. the system logic monitoring such an access can assert smi#. then the smm service routine would query the system logic, detect a failed i/o write, take action to power-up the i/o device, enable the i/o trap restart slot feature, and return from smm. the fields of the i/o trap restart slot are defined as follows: n bits 31C16 reserved n bits 15C0 i/o instruction restart on return from smm: 0000h = execute the next instruction after the trapped i/o instruction 00ffh = re-execute the trapped i/o instruction table 11. i/o trap dword configuration 3116 154 3 2 1 0 i/o port address reserved rep string operation i/o string operation valid i/o instruction input or output
50 mobile amd-k6 ? -2 processor operation chapter 5 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information table 12 shows the format of the i/o trap restart slot. the processor initializes the i/o trap restart slot to 0000h upon entry into smm. if smm was entered due to a trapped i/o instruction, the processor indicates the validity of the i/o instruction by setting or clearing bit 1 of the i/o trap dword at offset ffa4h in the smm state-save area. the smm service routine should test bit 1 of the i/o trap dword to determine if a valid i/o instruction was being executed when entering smm and before writing the i/o trap restart slot. if the i/o instruction is valid, the smm service routine can safely rewrite the i/o trap restart slot with the value 00ffh, which causes the processor to re-execute the trapped i/o instruction when the rsm instruction is executed. if the i/o instruction is invalid, writing the i/o trap restart slot has undefined results. if a second smi# is asserted and a valid i/o instruction was trapped by the first smm handler, the cpu services the second smi# prior to re-executing the trapped i/o instruction. the second entry into smm never has bit 1 of the i/o trap dword set, and the second smm service routine must not rewrite the i/o trap restart slot. during a simultaneous smi# i/o instruction trap and debug breakpoint trap, the mobile amd-k6-2 processor first responds to the smi# and postpones recognizing the debug exception until after returning from smm via the rsm instruction. if the debug registers dr3Cdr0 are used while in smm, they must be saved and restored by the smm handler. the processor automatically saves and restores dr7Cdr6. if the i/o trap restart slot in the smm state-save area contains the value 00ffh when the rsm instruction is executed, the debug trap does not occur until after the i/o instruction is re-executed. table 12. i/o trap restart slot 31C16 15C0 reserved i/o instruction restart on return from smm: n 0000h = execute the next instruction after the trapped i/o n 00ffh = re-execute the trapped i/o instruction
chapter 5 mobile amd-k6 ? -2 processor operation 51 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information exceptions, interrupts, and debug in smm during an smi# i/o trap, the exception/interrupt priority of the mobile amd-k6-2 processor changes from its normal priority. the normal priority places the debug traps at a priority higher than the sampling of the flush# or smi# signals. however, during an smi# i/o trap, the sampling of the flush# or smi# signals takes precedence over debug traps. the processor recognizes the assertion of nmi within smm immediately after the completion of an iret instruction. once nmi is recognized within smm, nmi recognition remains enabled until smm is exited, at which point nmi masking is restored to the state it was in before entering smm.
52 mobile amd-k6 ? -2 processor operation chapter 5 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information
chapter 6 signal switching characteristics 53 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 6 signal switching characteristics the mobile amd-k6-2 processor signal switching characteristics are presented in table 13 through table 22. valid delay, float, setup, and hold timing specifications are listed. these specifications are provided for the system designer to determine if the timings necessary for the processor to interface with the system logic are met. table 13 and table 14 contain the switching characteristics of the clk input. table 15 through table 18 contain the timings for the normal operation signals. table 19 and table 20 contain the timings for reset and the configuration signals. table 21 and table 22 contain the timings for the test operation signals. all signal timings provided are: n measured between clk, tck, or reset at 1.5 v and the corresponding signal at 1.5 vthis applies to input and output signals that are switching from low to high, or from high to low n based on input signals applied at a slew rate of 1 v/ns between 0 v and 3 v (rising) and 3 v to 0 v (falling) n valid within the operating ranges given in operating ranges on page 71 n based on a load capacitance (c l ) of 0 pf 6.1 clk switching characteristics table 13 and table 14 contain the switching characteristics of the clk input to the mobile amd-k6-2 processor for 100-mhz and 66-mhz bus operation, respectively, as measured at the voltage levels indicated by figure 9 on page 55. the clk period stability specifies the variance (jitter) allowed between successive periods of the clk input measured at 1.5 v. this parameter must be considered as one of the elements of clock skew between the mobile amd-k6-2 and the system logic.
54 signal switching characteristics chapter 6 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information 6.2 clock switching characteristics for 100-mhz bus operation 6.3 clock switching characteristics for 66-mhz bus operation table 13. clk switching characteristics for 100-mhz bus operation symbol parameter description preliminary data figure comments min max frequency 33.3 mhz 100 mhz in normal mode t 1 clk period 10.0 ns 9 in normal mode t 2 clk high time 3.0 ns 9 t 3 clk low time 3.0 ns 9 t 4 clk fall time 0.15 ns 1.5 ns 9 t 5 clk rise time 0.15 ns 1.5 ns 9 clk period stability 250 ps note note: jitter frequency power spectrum peaking must occur at frequencies greater than (frequency of clk)/3 or less than 500 khz. table 14. clk switching characteristics for 66-mhz bus operation symbol parameter description preliminary data figure comments min max frequency 33.3 mhz 66.6 mhz in normal mode t 1 clk period 15.0 ns 30.0 ns 9 in normal mode t 2 clk high time 4.0 ns 9 t 3 clk low time 4.0 ns 9 t 4 clk fall time 0.15 ns 1.5 ns 9 t 5 clk rise time 0.15 ns 1.5 ns 9 clk period stability 250 ps note note: jitter frequency power spectrum peaking must occur at frequencies greater than (frequency of clk)/3 or less than 500 khz.
chapter 6 signal switching characteristics 55 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information figure 9. clk waveform 6.4 valid delay, float, setup, and hold timings valid delay and float timings are given for output signals during functional operation and are given relative to the rising edge of clk. during boundary-scan testing, valid delay and float timings for output signals are with respect to the falling edge of tck. the maximum valid delay timings are provided to allow a system designer to determine if setup times to the system logic can be met. likewise, the minimum valid delay timings are used to analyze hold times to the system logic. the setup and hold time requirements for the mobile amd-k6-2 processor input signals must be met by the system logic to assure the proper operation of the processor. the setup and hold timings during functional and boundary-scan test mode are given relative to the rising edge of clk and tck, respectively. t 5 2.0 v 1.5 v 0.8 v t 2 t 3 t 4 t 1
56 signal switching characteristics chapter 6 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information 6.5 output delay timings for 100-mhz bus operation table 15. output delay timings for 100-mhz bus operation symbol parameter description preliminary data figure comments min max t 6 a[31:3] valid delay 1.1 ns 4.0 ns 11 t 7 a[31:3] float delay 7.0 ns 12 t 8 ads# valid delay 1.0 ns 4.0 ns 11 t 9 ads# float delay 7.0 ns 12 t 10 adsc# valid delay 1.0 ns 4.0 ns 11 t 11 adsc# float delay 7.0 ns 12 t 12 ap valid delay 1.0 ns 5.5 ns 11 t 13 ap float delay 7.0 ns 12 t 14 apchk# valid delay 1.0 ns 4.5 ns 11 t 15 be[7:0]# valid delay 1.0 ns 4.0 ns 11 t 16 be[7:0]# float delay 7.0 ns 12 t 17 breq valid delay 1.0 ns 4.0 ns 11 t 18 cache# valid delay 1.0 ns 4.0 ns 11 t 19 cache# float delay 7.0 ns 12 t 20 d/c# valid delay 1.0 ns 4.0 ns 11 t 21 d/c# float delay 7.0 ns 12 t 22 d[63:0] write data valid delay 1.3 ns 4.5 ns 11 t 23 d[63:0] write data float delay 7.0 ns 12 t 24 dp[7:0] write data valid delay 1.3 ns 4.5 ns 11 t 25 dp[7:0] write data float delay 7.0 ns 12 t 26 ferr# valid delay 1.0 ns 4.5 ns 11 t 27 hit# valid delay 1.0 ns 4.0 ns 11 t 28 hitm# valid delay 1.1 ns 4.0 ns 11 t 29 hlda valid delay 1.0 ns 4.0 ns 11 t 30 lock# valid delay 1.1 ns 4.0 ns 11 t 31 lock# float delay 7.0 ns 12 t 32 m/io# valid delay 1.0 ns 4.0 ns 11 t 33 m/io# float delay 7.0 ns 12
chapter 6 signal switching characteristics 57 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information t 34 pcd valid delay 1.0 ns 4.0 ns 11 t 35 pcd float delay 7.0 ns 12 t 36 pchk# valid delay 1.0 ns 4.5 ns 11 t 37 pwt valid delay 1.0 ns 4.0 ns 11 t 38 pwt float delay 7.0 ns 12 t 39 scyc valid delay 1.0 ns 4.0 ns 11 t 40 scyc float delay 7.0 ns 12 t 41 smiact# valid delay 1.0 ns 4.0 ns 11 t 42 w/r# valid delay 1.0 ns 4.0 ns 11 t 43 w/r# float delay 7.0 ns 12 table 15. output delay timings for 100-mhz bus operation (continued) symbol parameter description preliminary data figure comments min max
58 signal switching characteristics chapter 6 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information 6.6 input setup and hold timings for 100-mhz bus operation table 16. input setup and hold timings for 100-mhz bus operation symbol parameter description preliminary data figure comments min max t 44 a[31:5] setup time 3.0 ns 13 t 45 a[31:5] hold time 1.0 ns 13 t 46 a20m# setup time 3.0 ns 13 note 1 t 47 a20m# hold time 1.0 ns 13 note 1 t 48 ahold setup time 3.5 ns 13 t 49 ahold hold time 1.0 ns 13 t 50 ap setup time 1.7 ns 13 t 51 ap hold time 1.0 ns 13 t 52 boff# setup time 3.5 ns 13 t 53 bof f# hold time 1.0 ns 13 t 54 brdy# setup time 3.0 ns 13 t 55 brdy# hold time 1.0 ns 13 t 56 brdyc# setup time 3.0 ns 13 t 57 brdyc# hold time 1.0 ns 13 t 58 d[63:0] read data setup time 1.7 ns 13 t 59 d[63:0] read data hold time 1.5 ns 13 t 60 dp[7:0] read data setup time 1.7 ns 13 t 61 dp[7:0] read data hold time 1.5 ns 13 t 62 eads# setup time 3.0 ns 13 t 63 eads# hold time 1.0 ns 13 t 64 ewbe# setup time 1.7 ns 13 t 65 ewb e# hold time 1.0 ns 13 t 66 flush# setup time 1.7 ns 13 note 2 t 67 flush# hold time 1.0 ns 13 note 2 notes: 1. these level-sensitive signals can be asserted synchronously or asynchronously. to be sampled on a specific clock edge, setup and hold times must be met. if asserted asynchronously, they must be asserted for a minimum pulse width of two clocks. 2. these edge-sensitive signals can be asserted synchronously or asynchronously. to be sampled on a specific clock edge, setup a nd hold times must be met. if asserted asynchronously, they must have been negated at least two clocks prior to assertion and must remain asserted at least two clocks.
chapter 6 signal switching characteristics 59 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information t 68 hold setup time 1.7 ns 13 t 69 hold hold time 1.5 ns 13 t 70 ignne# setup time 1.7 ns 13 note 1 t 71 ignne# hold time 1.0 ns 13 note 1 t 72 init setup time 1.7 ns 13 note 2 t 73 init hold time 1.0 ns 13 note 2 t 74 intr setup time 1.7 ns 13 note 1 t 75 intr hold time 1.0 ns 13 note 1 t 76 inv setup time 1.7 ns 13 t 77 inv hold time 1.0 ns 13 t 78 ken# setup time 3.0 ns 13 t 79 ke n# hold time 1.0 ns 13 t 80 na# setup time 1.7 ns 13 t 81 na# hold time 1.0 ns 13 t 82 nmi setup time 1.7 ns 13 note 2 t 83 nmi hold time 1.0 ns 13 note 2 t 84 smi# setup time 1.7 ns 13 note 2 t 85 smi# hold time 1.0 ns 13 note 2 t 86 stpclk# setup time 1.7 ns 13 note 1 t 87 stpclk# hold time 1.0 ns 13 note 1 t 88 wb/wt# setup time 1.7 ns 13 t 89 wb/wt# hold time 1.0 ns 13 table 16. input setup and hold timings for 100-mhz bus operation (continued) symbol parameter description preliminary data figure comments min max notes: 1. these level-sensitive signals can be asserted synchronously or asynchronously. to be sampled on a specific clock edge, setup and hold times must be met. if asserted asynchronously, they must be asserted for a minimum pulse width of two clocks. 2. these edge-sensitive signals can be asserted synchronously or asynchronously. to be sampled on a specific clock edge, setup a nd hold times must be met. if asserted asynchronously, they must have been negated at least two clocks prior to assertion and must remain asserted at least two clocks.
60 signal switching characteristics chapter 6 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information 6.7 output delay timings for 66-mhz bus operation table 17. output delay timings for 66-mhz bus operation symbol parameter description preliminary data figure comments min max t 6 a[31:3] valid delay 1.1 ns 6.3 ns 11 t 7 a[31:3] float delay 10.0 ns 12 t 8 ads# valid delay 1.0 ns 6.0 ns 11 t 9 ads# float delay 10.0 ns 12 t 10 adsc# valid delay 1.0 ns 7.0 ns 11 t 11 adsc# float delay 10.0 ns 12 t 12 ap valid delay 1.0 ns 8.5 ns 11 t 13 ap float delay 10.0 ns 12 t 14 apchk# valid delay 1.0 ns 8.3 ns 11 t 15 be[7:0}# valid delay 1.0 ns 7.0 ns 11 t 16 be[7:0}# float delay 10.0 ns 12 t 17 breq valid delay 1.0 ns 8.0 ns 11 t 18 cache# valid delay 1.0 ns 7.0 ns 11 t 19 cache# float delay 10.0 ns 12 t 20 d/c# valid delay 1.0 ns 7.0 ns 11 t 21 d/c# float delay 10.0 ns 12 t 22 d[63:0] write data valid delay 1.3 ns 7.5 ns 11 t 23 d[63:0] write data float delay 10.0 ns 12 t 24 dp[7:0] write data valid delay 1.3 ns 7.5 ns 11 t 25 dp[7:0] write data float delay 10.0 ns 12 t 26 ferr# valid delay 1.0 ns 8.3 ns 11 t 27 hit# valid delay 1.0 ns 6.8 ns 11 t 28 hitm# valid delay 1.1 ns 6.0 ns 11 t 29 hlda valid delay 1.0 ns 6.8 ns 11 t 30 lock# valid delay 1.1 ns 7.0 ns 11 t 31 lock# float delay 10.0 ns 12 t 32 m/io# valid delay 1.0 ns 5.9 ns 11 t 33 m/io# float delay 10.0 ns 12
chapter 6 signal switching characteristics 61 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information t 34 pcd valid delay 1.0 ns 7.0 ns 11 t 35 pcd float delay 10.0 ns 12 t 36 pchk# valid delay 1.0 ns 7.0 ns 11 t 37 pwt valid delay 1.0 ns 7.0 ns 11 t 38 pwt float delay 10.0 ns 12 t 39 scyc valid delay 1.0 ns 7.0 ns 11 t 40 scyc float delay 10.0 ns 12 t 41 smiact# valid delay 1.0 ns 7.3 ns 11 t 42 w/r# valid delay 1.0 ns 7.0 ns 11 t 43 w/r# float delay 10.0 ns 12 table 17. output delay timings for 66-mhz bus operation (continued) symbol parameter description preliminary data figure comments min max
62 signal switching characteristics chapter 6 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information 6.8 input setup and hold timings for 66-mhz bus operation table 18. input setup and hold timings for 66-mhz bus operation symbol parameter description preliminary data figure comments min max t 44 a[31:5] setup time 6.0 ns 13 t 45 a[31:5] hold time 1.0 ns 13 t 46 a20m# setup time 5.0 ns 13 note 1 t 47 a20m# hold time 1.0 ns 13 note 1 t 48 ahold setup time 5.5 ns 13 t 49 ahold hold time 1.0 ns 13 t 50 ap setup time 5.0 ns 13 t 51 ap hold time 1.0 ns 13 t 52 boff# setup time 5.5 ns 13 t 53 bof f# hold time 1.0 ns 13 t 54 brdy# setup time 5.0 ns 13 t 55 brdy# hold time 1.0 ns 13 t 56 brdyc# setup time 5.0 ns 13 t 57 brdyc# hold time 1.0 ns 13 t 58 d[63:0] read data setup time 2.8 ns 13 t 59 d[63:0] read data hold time 1.5 ns 13 t 60 dp[7:0] read data setup time 2.8 ns 13 t 61 dp[7:0] read data hold time 1.5 ns 13 t 62 eads# setup time 5.0 ns 13 t 63 eads# hold time 1.0 ns 13 t 64 ewbe# setup time 5.0 ns 13 t 65 ewb e# hold time 1.0 ns 13 t 66 flush# setup time 5.0 ns 13 note 2 t 67 flush# hold time 1.0 ns 13 note 2 notes: 1. these level-sensitive signals can be asserted synchronously or asynchronously. to be sampled on a specific clock edge, setup and hold times must be met. if asserted asynchronously, they must be asserted for a minimum pulse width of two clocks. 2. these edge-sensitive signals can be asserted synchronously or asynchronously. to be sampled on a specific clock edge, setup a nd hold times must be met. if asserted asynchronously, they must have been negated at least two clocks prior to assertion and must remain asserted at least two clocks.
chapter 6 signal switching characteristics 63 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information t 68 hold setup time 5.0 ns 13 t 69 hold hold time 1.5 ns 13 t 70 ignne# setup time 5.0 ns 13 note 1 t 71 ignne# hold time 1.0 ns 13 note 1 t 72 init setup time 5.0 ns 13 note 2 t 73 init hold time 1.0 ns 13 note 2 t 74 intr setup time 5.0 ns 13 note 1 t 75 intr hold time 1.0 ns 13 note 1 t 76 inv setup time 5.0 ns 13 t 77 inv hold time 1.0 ns 13 t 78 ken# setup time 5.0 ns 13 t 79 ke n# hold time 1.0 ns 13 t 80 na# setup time 4.5 ns 13 t 81 na# hold time 1.0 ns 13 t 82 nmi setup time 5.0 ns 13 note 2 t 83 nmi hold time 1.0 ns 13 note 2 t 84 smi# setup time 5.0 ns 13 note 2 t 85 smi# hold time 1.0 ns 13 note 2 t 86 stpclk# setup time 5.0 ns 13 note 1 t 87 stpclk# hold time 1.0 ns 13 note 1 t 88 wb/wt# setup time 4.5 ns 13 t 89 wb/wt# hold time 1.0 ns 13 table 18. input setup and hold timings for 66-mhz bus operation (continued) symbol parameter description preliminary data figure comments min max notes: 1. these level-sensitive signals can be asserted synchronously or asynchronously. to be sampled on a specific clock edge, setup and hold times must be met. if asserted asynchronously, they must be asserted for a minimum pulse width of two clocks. 2. these edge-sensitive signals can be asserted synchronously or asynchronously. to be sampled on a specific clock edge, setup a nd hold times must be met. if asserted asynchronously, they must have been negated at least two clocks prior to assertion and must remain asserted at least two clocks.
64 signal switching characteristics chapter 6 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information 6.9 reset and test signal timing table 19. reset and configuration signals for 100-mhz bus operation symbol parameter description preliminary data figure comments min max t 90 reset setup time 1.7 ns 14 t 91 reset hold time 1.0 ns 14 t 92 reset pulse width, v cc and clk stable 15 clocks 14 t 93 reset active after v cc and clk stable 1.0 ms 14 t 94 bf[2:0] setup time 1.0 ms 14 note 3 t 95 bf[2:0] hold time 2 clocks 14 note 3 t 96 brdyc# hold time 1.0 ns 14 note 4 t 97 brdyc# setup time 2 clocks 14 note 2 t 98 brdyc# hold time 2 clocks 14 note 2 t 99 flush# setup time 1.7 ns 14 note 1 t 100 flush# hold time 1.0 ns 14 note 1 t 101 flush# setup time 2 clocks 14 note 2 t 102 flush# hold time 2 clocks 14 note 2 notes: 1. to be sampled on a specific clock edge, setup and hold times must be met the clock edge before the clock edge on which reset is sampled negated. 2. if asserted asynchronously, these signals must meet a minimum setup and hold time of two clocks relative to the negation of reset. 3. bf[2:0] must meet a minimum setup time of 1.0 ms and a minimum hold time of two clocks relative to the negation of reset. 4. if reset is driven synchronously, brdyc# must meet the specified hold time relative to the negation of reset.
chapter 6 signal switching characteristics 65 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information table 20. reset and configuration signals for 66-mhz bus operation symbol parameter description preliminary data figure comments min max t 90 reset setup time 5.0 ns 14 t 91 reset hold time 1.0 ns 14 t 92 reset pulse width, v cc and clk stable 15 clocks 14 t 93 reset active after v cc and clk stable 1.0 ms 14 t 94 bf[2:0] setup time 1.0 ms 14 note 3 t 95 bf[2:0] hold time 2 clocks 14 note 3 t 96 brdyc# hold time 1.0 ns 14 note 4 t 97 brdyc# setup time 2 clocks 14 note 2 t 98 brdyc# hold time 2 clocks 14 note 2 t 99 flush# setup time 5.0 ns 14 note 1 t 100 flush# hold time 1.0 ns 14 note 1 t 101 flush# setup time 2 clocks 14 note 2 t 102 flush# hold time 2 clocks 14 note 2 notes: 1. to be sampled on a specific clock edge, setup and hold times must be met the clock edge before the clock edge on which reset is sampled negated. 2. if asserted asynchronously, these signals must meet a minimum setup and hold time of two clocks relative to the negation of reset. 3. bf[2:0] must meet a minimum setup time of 1.0 ms and a minimum hold time of two clocks relative to the negation of reset. 4. if reset is driven synchronously, brdyc# must meet the specified hold time relative to the negation of reset.
66 signal switching characteristics chapter 6 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information table 21. tck waveform and trst# timing at 25 mhz symbol parameter description preliminary data figure comments min max tck frequency 25 mhz 15 t 103 tck period 40.0 ns 15 t 104 tck high time 14.0 ns 15 t 105 tck low time 14.0 ns 15 t 106 tck fall time 5.0 ns 15 note 1, 2 t 107 tck rise time 5.0 ns 15 note 1, 2 t 108 trst# pulse width 30.0 ns 16 asynchronous notes: 1. rise/fall times can be increased by 1.0 ns for each 10 mhz that tck is run below its maximum frequency of 25 mhz. 2. rise/fall times are measured between 0.8 v and 2.0 v. table 22. test signal timing at 25 mhz symbol parameter description preliminary data figure notes min max t 109 tdi setup time 5.0 ns 17 note 2 t 110 tdi hold time 9.0 ns 17 note 2 t 111 tms setup time 5.0 ns 17 note 2 t 112 tms hold time 9.0 ns 17 note 2 t 113 tdo valid delay 3.0 ns 13.0 ns 17 note 1 t 114 tdo float delay 16.0 ns 17 note 1 t 115 all outputs (non-test) valid delay 3.0 ns 13.0 ns 17 note 1 t 116 all outputs (non-test) float delay 16.0 ns 17 note 1 t 117 all inputs (non-test) setup time 5.0 ns 17 note 2 t 118 all inputs (non-test) hold time 9.0 ns 17 note 2 notes: 1. parameter is measured from the tck falling edge. 2. parameter is measured from the tck rising edge.
chapter 6 signal switching characteristics 67 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information figure 10. diagrams key figure 11. output valid delay timing must be steady can change from high to low can change from low to high (does not apply) dont care, any change permitted steady changing from high to low changing from low to high changing, state unknown center line is high impedance state waveform inputs outputs min max valid n +1 t v valid n clk output signal t x t x 1.5 v v = 6, 8, 10, 12, 14, 15, 17, 18, 20, 22, 24, 26, 27, 28, 29, 30, 32, 34, 36, 37, 39, 41, 42
68 signal switching characteristics chapter 6 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information figure 12. maximum float delay timing figure 13. input setup and hold timing t x t x t x valid t x t v min output signal t f clk 1.5 v v = 6, 8, 10, 12, 15, 18, 20, 22, 24, 30, 32, 34, 37, 39, 42 f = 7, 9, 11, 13, 16, 19, 21, 23, 25, 31, 33, 35, 38, 40, 43 clk t x t x t x t x input signal t s t h 1.5 v s = 44, 46, 48, 50, 52, 54, 56, 58, 60, 62, 64, 66, 68, 70, 72, 74, 76, 78, 80, 82, 84, 86, 88 h = 45, 47, 49, 51, 53, 55, 57, 59, 61, 63, 65, 67, 69, 71, 73, 75, 77, 79, 81, 83, 85, 87, 89
chapter 6 signal switching characteristics 69 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information figure 14. reset and configuration timing t x clk reset t x t 90 flush# (synchronous) 1.5 v 1.5 v 1.5 v ? ? ? t 92, 93 t 91 t 99 t 10 0 ? ? ? bf[2:0] (asynchronous) t 94 ? ? ? t 95 flush#, brdyc# (asynchronous) t 97, 101 t 98, 102 ? ? ? ? ? ?
70 signal switching characteristics chapter 6 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information figure 15. tck waveform figure 16. trst# timing figure 17. test signal timing diagram t 107 2.0 v 1.5 v 0.8 v t 10 5 t 10 6 t 10 3 t 10 4 1.5 v t 10 8 tck tdi, tms tdo output signals input signals t 10 3 t 109, 111 t 110 , 112 t 113 t 115 t 116 t 117 t 118 t 114 1.5 v
chapter 7 electrical data 71 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 7 electrical data 7.1 operating ranges the mobile amd-k6-2 processor is designed to provide functional operation if the voltage and temperature parameters are within the limits defined in table 23. 7.2 absolute ratings the amd-k6-2 processor is not designed to be operated beyond the operating ranges listed in table 23. exposure to conditions outside these operating ranges for extended periods of time can affect long-term reliability. permanent damage can occur if the absolute ratings listed in table 24 are exceeded. table 23. operating ranges parameter minimum typical maximum comments v cc2 1.7 v 1.8 v 1.9 v note 1, 2 v cc3 3.135 v 3.3 v 3.6 v note 1 t case 0 c85 c (cbga) 85 c (cpga) note: 1. v cc2 and v cc3 are referenced from v ss . 2. v cc2 specification for 1.8 v component. table 24. absolute ratings parameter minimum maximum comments v cc2 C0.5 v 2.6 v v cc3 C0.5 v 3.6 v v pin C0.5 v v cc3 + 0.5 v and < 4.0 v note t case (under bias) C65 c +110 c t storage C65 c +150 c note: v pin (the voltage on any i/o pin) must not be greater than 0.5 v above the voltage being applied to v cc3 . in addition, the v pin voltage must never exceed 4.0 v.
72 electrical data chapter 7 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information 7.3 dc characteristics the dc characteristics of the mobile amd-k6-2 processor are shown in table 25. table 25. dc characteristics symbol parameter description preliminary data comments min max v il input low voltage C0.3 v +0.8 v v ih input high voltage 2.0 v v cc3 +0.3v note 1 v ol output low voltage 0.4 v i ol = 4.0-ma load v oh output high voltage 2.4 v i oh = 3.0-ma load i cc2 1.8 v power supply current 5.05 a 266 mhz, note 2, 7 5.50 a 300 mhz, note 2, 8 6.25 a 333 mhz, note 2, 9 i cc3 3.3 v power supply current 0.54 a 266 mhz, note 3, 7 0.56 a 300 mhz, note 3, 8 0.58 a 333 mhz, note 3, 9 i li input leakage current 15 m a note 4 i lo output leakage current 15 m a note 4 i il input leakage current bias with pullup C400 m a note 5 i ih input leakage current bias with pulldown 200 m a note 6 c in input capacitance 10 pf c out output capacitance 15 pf c out i/o capacitance 20 pf c clk clk capacitance 10 pf notes: 1. v cc3 refers to the voltage being applied to v cc3 during functional operation. 2. v cc2 = 1.9 v the maximum power supply current must be taken into account when designing a power supply. 3. v cc3 = 3.6 v the maximum power supply current must be taken into account when designing a power supply. 4. refers to inputs and i/o without an internal pullup resistor and 0 v in v cc3. 5. refers to inputs with an internal pullup and v il = 0.4 v. 6. refers to inputs with an internal pulldown and v ih = 2.4 v. 7. this specification applies to components using a clk frequency of 66 mhz. 8. this specification applies to components using a clk frequency of 66 mhz or 100 mhz. 9. this specification applies to components using a clk frequency of 66 mhz or 95 mhz.
chapter 7 electrical data 73 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information c tin test input capacitance (tdi, tms, trst#) 10 pf c tout test output capacitance (tdo) 15 pf c tck tck capacitance 10 pf table 25. dc characteristics (continued) symbol parameter description preliminary data comments min max notes: 1. v cc3 refers to the voltage being applied to v cc3 during functional operation. 2. v cc2 = 1.9 v the maximum power supply current must be taken into account when designing a power supply. 3. v cc3 = 3.6 v the maximum power supply current must be taken into account when designing a power supply. 4. refers to inputs and i/o without an internal pullup resistor and 0 v in v cc3. 5. refers to inputs with an internal pullup and v il = 0.4 v. 6. refers to inputs with an internal pulldown and v ih = 2.4 v. 7. this specification applies to components using a clk frequency of 66 mhz. 8. this specification applies to components using a clk frequency of 66 mhz or 100 mhz. 9. this specification applies to components using a clk frequency of 66 mhz or 95 mhz.
74 electrical data chapter 7 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information 7.4 power dissipation table 26 contains the typical and maximum power dissipation of the mobile amd-k6-2 processor during normal and reduced power states. table 26. typical and maximum power dissipation clock control state 266 mhz 6 300 mhz 7 333 mhz 8 comments typ max typ max typ max design power 8.00 w 9.00 w 8.85 w 10.00 w 9.65 w 11.00 w note 1, 2 application power 6.30 w -- 7.00 w -- 7.70 w -- note 3 stop grant / halt (maximum) -- 1.20 w -- 1.20 w -- 1.20 w note 4 stop clock (maximum) -- 1.00 w -- 1.00 w -- 1.00 w note 5 notes: 1. design power max represents the total power dissipated by all components within the processor while executing a worse- case instruction sequence under normal system operation with v cc2 = 1.8 v and v cc3 = 3.3 v. thermal solutions must be designed to dissipate the processors maximum design power unless the system uses thermal feedback to limit the processors maximum power. 2. design power typ represents the maximum power dissipated while executing software or instruction sequences under normal system operation with v cc2 = 1.8 v and v cc3 = 3.3 v. 3. application power represents the average power dissipated while executing software or instruction sequences under normal system operation with v cc2 = 1.8 v and v cc3 = 3.3 v. 4. the clk signal and the internal pll are still running but most internal clocking has stopped. 5. the clk signal, the internal pll, and all internal clocking has stopped. 6. this specification applies to components using a clk frequency of 66 mhz. 7. this specification applies to components using a clk frequency of 66 mhz or 100 mhz. 8. this specification applies to components using a clk frequency of 66 mhz or 95 mhz.
chapter 7 electrical data 75 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 7.5 power and grounding power connections the mobile amd-k6-2 processor is a dual voltage device. two separate supply voltages are required: v cc2 and v cc3 . v cc2 provides the core voltage for the mobile amd-k6-2 processor and v cc3 provides the i/o voltage. see electrical data on page 71 for the value and range of v cc2 and v cc3 . there are 28 v cc2 , 32 v cc3 , and 68 v ss pins on the cpga and 42 v cc2 , 42 v cc3 , and 85 v ss pins on the cbga mobile amd-k6-2. (see chapter 10, pin description diagrams on page 89 for all power and ground pin designations.) the large number of power and ground pins are provided to ensure that the processor and package maintain a clean and stable power distribution network. for proper operation and functionality, all v cc2 , v cc3 , and v ss pins must be connected to the appropriate planes in the circuit board. the power planes have been arranged in a pattern to simplify routing and minimize crosstalk on the circuit board. the isolation region between two voltage planes must be at least 0.254mm if they are in the same layer of the circuit board. (see figure 18 on page 76.) in order to maintain low-impedance current sink and reference, the ground plane must never be split. although the mobile amd-k6-2 processor has two separate supply voltages, there are no special power sequencing requirements. the best procedure is to minimize the time between which v cc2 and v cc3 are either both on or both off.
76 electrical data chapter 7 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information figure 18. suggested component placement cpga package v cc2 (core) plane v cc3 (i/o) plane 0.254mm (min.) for isolation region c1 cc5 cc3 c2 + + + + c5 c6 c7 c8 c9 c10 c17 c18 c19 c20 c21 c22 c23 c24 c25 c26 c27 c28 c29 c30 c31 cc4 + cc6 c14 c15 c16 cc8 cc7 w v u t r p n m l k j h g f e d c b a w v u t r p n m l k j h g f e d c b a 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 bottom view cc6 cc5 cc4 cc3 other vss pins v cc3 pins v cc2 pins c1 c2 cc7 cc10 0.254mm (min.) for isolation region cc9 cc8 cbga package
chapter 7 electrical data 77 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information decoupling recommendations in addition to the isolation region mentioned in power connections on page 75, adequate decoupling capacitance is required between the two system power planes and the ground plane to minimize ringing and to provide a low-impedance path for return currents. suggested decoupling capacitor placement is shown in figure 18 on page 76. surface mounted capacitors should be used as close as possible to the processor to minimize resistance and inductance in the lead lengths while maintaining minimal height. for recommendations regarding the value, quantity, and location of the capacitors illustrated in figure 18, see the mobile amd-k6 ? processor power supply application note , order# 22495. pin connection requirements for proper operation, the following requirements for signal pin connections must be met: n do not drive address and data signals into large capacitive loads at high frequencies. if necessary, use buffer chips to drive large capacitive loads. n leave all nc (no-connect) pins unconnected. n unused inputs should always be connected to an appropriate signal level. ? active low inputs that are not being used should be connected to v cc3 through a 20k-ohm pullup resistor. ? active high inputs that are not being used should be connected to gnd through a pulldown resistor. n reserved signals (cpga only) can be treated in one of the following ways: ? as no-connect (nc) pins, in which case these pins are left unconnected ? as pins connected to the system logic as defined by the industry-standard super7 and socket 7 interface ? any combination of nc and socket 7 pins n keep trace lengths to a minimum.
78 electrical data chapter 7 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information
chapter 8 thermal design 79 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 8 thermal design 8.1 package thermal specifications the mobile amd-k6-2 processor operating specifications call for the case temperature (t c ) to be in the range of 0c to 85c for the cbga package and 0c to 85c for the cpga package. the ambient temperature (t a ) is not specified as long as the case temperature is not violated. the case temperature must be measured on the top center of the package. table 27 shows the mobile amd-k6-2 processor thermal specifications. figure 19 on page 80 shows the thermal model of a processor with a passive thermal solution. the case-to-ambient temperature (t ca ) can be calculated from the following equation: t ca = p max ? q ca = p max ? ( q if + q sa ) where: p max = maximum power consumption q ca = case-to-ambient thermal resistance q if = interface material thermal resistance q sa = sink-to-ambient thermal resistance table 27. package thermal specifications t c case temperature maximum design power 1.8 v component 266 mhz 300 mhz 333 mhz 0c C 85c (cbga) 0c C 85c (cpga) 9.00 w 10.00 w 11.00 w
80 thermal design chapter 8 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information figure 19. thermal model (cbga package) figure 20 illustrates the case-to-ambient temperature (t ca ) in relation to the power consumption (x-axis) and the thermal resistance (y-axis). if the power consumption and case temperature are known, the thermal resistance ( q ca ) requirement can be calculated for a given ambient temperature (t a ) value. figure 20. power consumption versus thermal resistance the thermal resistance of a heatsink is determined by the heat dissipation surface area, the material and shape of the heatsink, and the airflow volume across the heatsink. in general, the larger the surface area the lower the thermal resistance. temperature thermal q sa q ca q if (c/w) (ambient) case sink t ca substrate heat exchange device resistance 0.0 1.0 2.0 3.0 4.0 5.0 6.0 6 w 9 w 12 w 15 w 18 w power consumption (watts) thermal resistance (c/w) 30 c 25 c 20 c 15 c t ca t ca = t c - t a
chapter 8 thermal design 81 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information the required thermal resistance of a heatsink ( q sa ) can be calculated using the following example: if: t c = 85c (cbga package) t a = 55c p max = 11.00w at 333mhz then: thermal grease is recommended as interface material because it provides the lowest thermal resistance (approx. 0.20c/w). the required thermal resistance ( q sa ) of the heat sink in this example is calculated as follows: q sa = q ca C q if = 2.73 C 0.20 = 2.53(c/w) heat dissipation path figure 21 illustrates the heat dissipation path of the processor. due to the lower thermal resistance between the processor die junction and case, most of the heat generated by the processor is transferred from the top surface of the case. part of the heat generated from the bottom side of the processor is dissipated to the circuit board through the ball contacts. figure 21. processors heat dissipation path (cbga package) q ca t c t a C p max ------------------ - ? ?? 30 c 11.00w --------------------- 2.73 cw () == substrate case temperature ambient temperature (ceramic) pcb
82 thermal design chapter 8 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information measuring case temperature the processor case temperature is measured to ensure that the thermal solution meets the processors operational specification. this temperature should be measured on the top center of the package where most of the heat is dissipated. figure 22 shows the correct location for measuring the case temperature. if a heatsink is installed while measuring, the thermocouple must be installed into the heatsink via a small hole drilled through the heatsink base (for example, 1/16 of an inch). the thermocouple is then attached to the base of the heatsink and the small hole filled using thermal epoxy, allowing the tip of the thermocouple to touch the top of the processor case. figure 22. measuring case temperature for more information on thermal design considerations, see the amd-k6 ? thermal solution design application note , order# 21085. thermocouple thermally conductive epoxy
chapter 9 package specifications 83 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 9 package specifications 9.1 321-pin staggered cpga package specification table 28. 321-pin staggered cpga package specification symbol millimeters inches notes min max min max a 49.28 49.78 1.940 1.960 b 45.59 45.85 1.795 1.805 c 31.01 32.89 1.221 1.295 d 44.90 45.10 1.768 1.776 e 2.91 3.63 0.115 0.143 f 1.30 1.52 0.051 0.060 g 3.05 3.30 0.120 0.130 h 0.43 0.51 0.017 0.020 m 2.29 2.79 0.090 0.110 n 1.14 1.40 0.045 0.055 d 1.52 2.29 0.060 0.090 e 1.52 2.54 0.060 0.100 f 0.13 0.005 flatness
84 package specifications chapter 9 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information figure 23. 321-pin staggered cpga package specification
chapter 9 package specifications 85 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 9.2 360-pin model 8 cbga package specification table 29. 360-pin model 8 cbga package specification symbol millimeters inches notes min max min max a 24.75 25.25 0.975 0.994 b 22.60 23.10 0.890 0.910 c 6.45 6.85 0.254 0.270 d 11.40 12.02 0.449 0.474 e 2.64 2.92 0.104 0.115 f 0.73 0.88 0.029 0.035 g 1.02 1.18 0.040 0.046 h 0.77 1.01 0.030 0.040 j13.650.5371 k20.140.7931 m 1.27 bsc. 0.050 bsc. e 0.11 0.004 2 f 0.10 0.004 flatness notes: 1. this area represents the component outline in which decoupling capacitors may be mounted on the ceramic by amd. 2. the decoupling capacitors shown in figure 24 on page 86 are for illustrative purposes only. amd will determine the exact placement and number of these capacitors.
86 package specifications chapter 9 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information figure 24. 360-pin cbga package specification a a b b c j e f m hh 0.150 t f e g d k m
chapter 9 package specifications 87 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 9.3 360-pin cbga mechanical specification table 30. 360-pin cbga mechanical specification parameter min max notes continuous compressive mechanical load 8 lbf 1 non-continuous compressive mechanical load 30 lbf 2 dynamic load during mechanical shock 5 lbf 3, 4, 5, 6 nominal package height rss tolerance 2.78 mm 0.130 7, 8 package height 2.64 mm 2.92 mm 7, 8 solder ball coplanarity 0.150 mm 7, 8 notes: 1. apply the load uniformly over the die surface. a compressible thermal pad is recommended to ensure load distribution and prevent of damage to the exposed silicon die during shipping and use. thermal greases and waxes are also acceptable. 2. this parameter represents a compressive load applied to the cbga for no more than 30 seconds. 3. the dynamic load represents the dynamic acceleration imparted to the total mass, which includes the chip carrier and any mass supported by the chip carrier. 4. for designs that apply a continuous load to the cbga, separation of the thermal interface must be prevented during mechanical shock. 5. this dynamic load specification is subject to the manner in which the board is supported. adequate mechanical support should be provided to minimize board flexure during mechanical shock and vibration. amd can provide example mechanical designs that exceed the dynamic specification. 6. amd recommends that mechanical shock be used as preconditioning prior to temperature cycling during system qualification. 7. the surface mount assembly and board flatness affect the tolerance in height and parallelism of the back of the mobile amd-k6-2 die relative to the board on which the cbga is mounted. 8. the root sum square (rss) specified tolerance acknowledges that the case of all the minimum or all the maximum tolerances occurring simultaneously is very remote. the rss preserves the confidence level at which the initial tolerances are specified. for example, if the component tolerances are estimated at 99.99% confidence, the rss combination is at 99.99% confidence.
88 package specifications chapter 9 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information
chapter 10 pin description diagrams 89 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 10 pin description diagrams 10.1 360-pin cbga pin diagrams figure 25. mobile amd-k6 ? -2 processor ball-side view (cbga) 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 w v u t r pnm l k j h g fe d c ba w v u t r pnm l k j h g fedc b a nmi be1# a20 init scyc a19 a18 a17 a16 a15 a11 a14 a12 a13 a8 a9 a10 a5 clk eads# be7# be4# bf0 ignne# be6# flush# intr be2# smi# boff# ads# ahold ap apchk# a4 a30 a24 stpclk# a27 a23 a25 a20m# brdy# breq cache# a21 dp7 d63 d61 d62 d60 d58 d59 d55 d56 d52 d53 d54 d49 d50 d51 d47 d48 d44 d45 d43 d41 d42 d46 d39 d40 d36 d37 d38 d33 d34 d35 d31 d32 d28 d29 d30 d25 d26 d27 d23 tdo# dp6 dp5 dp4 dp3 dp2 a22 ewbe# ferr# a28 reset hlda a26 a6 a29 inv ken# m/io# na# a3 bf2 pchk# hit# a7 a31 smiact# be5# d/c# w/r# trst# wb/wt# signal pin v ss v cc3 v cc2 no connects pcd brdyc# d15 d17 d20 d12 lock# d57 d9 d7 d4 dp1 d18 d21 d13 d10 dp0 d5 d3 d24 d22 d19 d16 d14 d11 d8 d6 d2 d1 hitm# pwt be0# adsc# be3# tck tms hold bf1 d0 tdi
90 pin description diagrams chapter 10 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information figure 26. mobile amd-k6 ? -2 processor top-side view (cbga) w v u t r p n m l k j h g f e d c b a w v u t r p n m l k j h g f e d c b a 19 18 17 16 15 14 13 12 11 10 9 8 7 65 4 3 21 19 18 17 16 15 14 13 12 11 10 9 8 7 6543 2 1 a3 a4 a5 a6 a7 a10 a9 a8 a13 a12 a11 a14 a15 a16 a17 a18 a19 a20 a21 a22 a23 a24 a25 a26 a27 a28 a29 a30 a31 a20m# ads# adsc# ahold ap apchk# be0# be1# be2# be3# be4# be5# be6# be7# bf0 bf1 boff# brdy# brdyc# breq cache# clk d0 d1 d2 d3 d4 d5 d6 d7 d8 d9 d10 d11 d12 d13 d14 d15 d16 d17 d18 d19 d20 d21 d22 d23 d24 d25 d26 d27 d28 d29 d30 d31 d32 d33 d34 d35 d36 d37 d38 d39 d40 d41 d42 d43 d44 d45 d46 d47 d48 d49 d50 d51 d52 d53 d54 d55 d56 d57 d58 d59 d60 d61 d62 d63 d/c# dp0 dp1 dp2 dp3 dp4 dp5 dp6 dp7 eads# ewbe# ferr# flush# hit# hitm# hlda hold ignne# init intr inv ken# lock# m/io# na# nmi pcd pchk# pwt reset scyc smi# smiact# stpclk# tck tdi tdo tms trst# w/r# wb/wt# signal pin v ss v cc3 v cc2 no connects bf2
chapter 10 pin description diagrams 91 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 10.2 321-pin cpga pin diagrams figure 27. mobile amd-k6 ? -2 processor bottom-side view (cpga)
92 pin description diagrams chapter 10 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information figure 28. mobile amd-k6 ? -2 processor top-side view (cpga)
chapter 10 pin description diagrams 93 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 10.3 pin designations by functional grouping pin name cpga pin no. cbga pin no. pin name cpga pin no. cbga pin no. pin name cpga pin no. cbga pin no. pin name cpga pin no. cbga pin no. address data control test a3 a4 a5 a6 a7 a8 a9 a10 a11 a12 a13 a14 a15 a16 a17 a18 a19 a20 a21 a22 a23 a24 a25 a26 a27 a28 a29 a30 a31 al-35 am-34 ak-32 an-33 al-33 am-32 ak-30 an-31 al-31 al-29 ak-28 al-27 ak-26 al-25 ak-24 al-23 ak-22 al-21 af-34 ah-36 ae-33 ag-35 aj-35 ah-34 ag-33 ak-36 ak-34 am-36 aj-33 p18 p19 r17 r18 r19 t17 t18 t19 u17 u18 u19 v18 v17 w17 u16 v16 w16 u15 k19 l17 l18 l19 m17 m18 m19 n17 n18 n19 p17 d0 d1 d2 d3 d4 d5 d6 d7 d8 d9 d10 d11 d12 d13 d14 d15 d16 d17 d18 d19 d20 d21 d22 d23 d24 d25 d26 d27 d28 d29 d30 d31 d32 d33 d34 d35 d36 d37 d38 d39 d40 d41 d42 d43 d44 d45 d46 d47 d48 d49 d50 d51 d52 d53 d54 d55 d56 d57 d58 d59 d60 d61 d62 d63 k-34 g-35 j-35 g-33 f-36 f-34 e-35 e-33 d-34 c-37 c-35 b-36 d-32 b-34 c-33 a-35 b-32 c-31 a-33 d-28 b-30 c-29 a-31 d-26 c-27 c-23 d-24 c-21 d-22 c-19 d-20 c-17 c-15 d-16 c-13 d-14 c-11 d-12 c-09 d-10 d-08 a-05 e-09 b-04 d-06 c-05 e-07 c-03 d-04 e-05 d-02 f-04 e-03 g-05 e-01 g-03 h-04 j-03 j-05 k-04 l-05 l-03 m-04 n-03 d17 c19 c18 b18 a17 b17 c17 a16 c16 a15 b15 c15 a14 b14 c14 a13 c13 a12 b12 c12 a11 b11 c11 a10 c10 a09 b09 c09 a08 b08 c08 a07 c07 a06 b06 c06 a05 b05 c05 a04 c04 a03 b03 b02 c01 c02 c03 d01 d03 e01 e02 e03 f01 f02 f03 g01 g03 h01 h02 h03 j01 j02 j03 k01 a20m# ads# adsc# ahold apchk# be0# be1# be2# be3# be4# be5# be6# be7# bf0 bf1 bf2 boff# brdy# brdyc# breq cache# clk d/c# eads# ewbe# ferr# flush# hit# hitm# hlda hold ignne# init intr inv ken# lock# m/io# na# nmi pcd pchk# pwt reset scyc smi# smiact# stpclk# vcc2det vcc2h/l# w/r# wb/wt# ak-08 aj-05 am-02 v-04 ae-05 al-09 ak-10 al-11 ak-12 al-13 ak-14 al-15 ak-16 y-33 x-34 w-35 z-04 x-04 y-03 aj-01 u-03 ak-18 ak-04 am-04 w-03 q-05 an-07 ak-06 al-05 aj-03 ab-04 aa-35 aa-33 ad-34 u-05 w-05 ah-04 t-04 y-05 ac-33 ag-05 af-04 al-03 ak-20 al-17 ab-34 ag-03 v-34 al-01 an-05 am-06 aa-05 v09 p03 w07 h19 r03 w09 w14 w13 w06 w11 v10 w12 v11 u12 h17 g17 j18 k03 m01 w03 t03 w10 w04 u11 u03 l03 u13 v08 u10 p02 j17 v12 v15 v13 t02 m02 p01 n01 t01 v14 u07 m03 v07 h18 w15 u14 u01 k18 n/a n/a w05 n03 tck tdi tdo tms trst# ap dp0 dp1 dp2 dp3 dp4 dp5 dp6 dp7 m-34 n-35 n-33 p-34 q-33 ak-02 d-36 d-30 c-25 d-18 c-07 f-06 f-02 n-05 d18 e17 d19 e18 e19 n02 b16 b13 b10 b07 b04 d02 g02 k02 parity
94 pin description diagrams chapter 10 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information cpga pin no. cbga pin no. cpga pin no. cbga pin no. cpga pin no. cbga pin no. cpga pin no. cbga pin no. cpga pin no. nc v cc2 v cc3 v ss inc a-37 e-17 e-25 r-34 s-33 s-35 w-33 aj-15 aj-23 al-19 an-35 a02 a18 a19 b01 b19 f17 f18 f19 g18 g19 j19 l01 l02 r01 r02 u02 u04 u05 u06 u08 u09 v01 v02 v03 v04 v05 v06 v19 w01 w02 w08 w18 w19 a-07 a-09 a-11 a-13 a-15 a-17 b-02 e-15 g-01 j-01 l-01 n-01 q-01 s-01 u-01 w-01 y-01 aa-01 ac-01 ae-01 ag-01 aj-11 an-09 an-11 an-13 an-15 an-17 an-19 f04 f05 f06 f07 g06 g07 h08 h09 h12 h13 j04 j05 j08 j09 j10 j11 j12 j13 k04 k05 k06 k07 k10 k11 l04 l05 l08 l09 l10 l11 l12 l13 m08 m09 m12 m13 n06 n07 p04 p05 p06 p07 a-19 a-21 a-23 a-25 a-27 a-29 e-21 e-27 e-37 g-37 j-37 l-33 l-37 n-37 q-37 s-37 t-34 u-33 u-37 w-37 y-37 aa-37 ac-37 ae-37 ag-37 aj-19 aj-29 an-21 an-23 an-25 an-27 an-29 d07 d08 d09 d12 d13 e07 e08 e09 e12 e13 f10 f11 f14 g10 g11 g14 g15 g16 h14 h15 h16 k17 m14 m15 m16 n10 n11 n14 n15 n16 p10 p11 p14 r07 r08 r09 r12 r13 t07 t08 t09 t12 t13 a-03 am-20 b-06 am-22 b-08 am-24 b-10 am-26 b-12 am-28 b-14 am-30 b-16 an-37 b-18 b-20 b-22 b-24 b-26 b-28 e-11 e-13 e-19 e-23 e-29 e-31 h-02 h-36 k-02 k-36 m-02 m-36 p-02 p-36 r-02 r-36 t-02 t-36 u-35 v-02 v-36 x-02 x-36 z-02 z-36 ab-02 ab-36 ad-02 ad-36 af-02 af-36 ah-02 aj-07 aj-09 aj-13 aj-17 aj-21 aj-25 aj-27 aj-31 aj-37 al-37 am-08 am-10 am-12 am-14 am-16 am-18 d04 n12 d05 n13 d06 p08 d10 p09 d11 p12 d14 p13 d15 p15 d16 p16 e04 r04 e05 r05 e06 r06 e10 r10 e11 r11 e14 r14 e15 r15 e16 r16 f08 t04 f09 t05 f12 t06 f13 t10 f15 t11 f16 t14 g04 t15 g05 t16 g08 g09 g12 g13 h04 h05 h06 h07 h10 h11 j06 j07 j14 j15 j16 k08 k09 k12 k13 k14 k15 k16 l06 l07 l14 l15 l16 m04 m05 m06 m07 m10 m11 n04 n05 n08 n09 c-01 h-34 y-35 z-34 ac-35 al-07 an-01 an-03 rsvd j-33 l-35 p-04 q-03 q-35 r-04 s-03 s-05 aa-03 ac-03 ac-05 ad-04 ae-03 ae-35 key ah-32
chapter 11 ordering information 95 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 11 ordering information standard products amd standard mobile products are available in several operating ranges. the ordering part number (opn) is formed by a combination of the elements below. table 31. valid ordering part number combinations opn package type operating voltage case temperature amd-k6-2/333anz amd-k6-2/333bnz 321-pin cpga 360-pin cbga 1.7vC1.9v (core) 3.135vC3.6v (i/o) 0cC85c (cpga) 0cC85c (cbga) amd-k6-2/300anz amd-k6-2/300bnz 321-pin cpga 360-pin cbga 1.7vC1.9v (core) 3.135vC3.6v (i/o) 0cC85c (cpga) 0cC85c (cbga) amd-k6-2/266anz amd-k6-2/266bnz 321-pin cpga 360-pin cbga 1.7vC1.9v (core) 3.135vC3.6v (i/o) 0cC85c (cpga) 0cC85c (cbga) note: this table lists configurations planned to be supported in volume for this device. consult the local amd sales office to confirm availability of specific valid combinations and to check on newly-released combinations. a amd-k6-2 package type family/core a = 321-pin cpga b = 360-pin cbga amd-k6-2 case temperature z = 0cC85c /333 performance rating /333 /300 /266 operating voltage n = 1.7 vC1.9 v (core) / 3.135 vC3.6 v (i/o) n z
96 ordering information chapter 11 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information
21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information part 2 mobile amd-k6 ? -2 processor data sheet 97 part two mobile amd-k6 -2-p processor the mobile amd-k6 ? -2 processor data sheet is a supplement to the amd-k6 ? -2 processor data sheet , order# 21850. when combined, the two data sheets provide the complete specification of the mobile amd-k6-2 and mobile amd-k6-2-p processors. the mobile amd-k6 ? -2 processor data sheet is divided in to two parts. part two (chapters 12C15) contains additional information specific to the mobile amd-k6-2-p processor. ?
98 mobile amd-k6 ? -2 processor data sheet part 2 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information
chapter 12 mobile amd-k6 ? -2-p processor 99 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 12 mobile amd-k6 ? -2-p processor n advanced 6-issue risc86 ? superscalar microarchitecture u ten parallel specialized execution units u multiple sophisticated x86-to-risc86 instruction decoders u advanced two-level branch prediction u speculative execution u out-of-order execution u register renaming and data forwarding u issues up to six risc86 instructions per clock n large on-chip split 64-kbyte level-one (l1) cache u 32-kbyte instruction cache with additional predecode cache u 32-kbyte writeback dual-ported data cache u mesi protocol support n high-performance ieee 754-compatible and 854-compatible floating-point unit n superscalar mmx? unit supports industry-standard mmx instructions n 3dnow!? technology for high-performance multimedia and 3d graphics capabilities n compatible with super7? 100-mhz frontside bus or socket 7 66-mhz notebook design n socket 7-compatible ceramic pin grid array (cpga) package n industry-standard system management mode (smm) n ieee 1149.1 boundary scan n x86 binary software compatibility n low voltage 0.25-micron process technology the mobile amd-k6-2-p processor is a high-performance cpu optimized for notebook pc designs. the mobile amd-k6-2-p processor is a natural extension of the mobile amd-k6-2 processor and incorporates the same leading-edge features, including the innovative and efficient risc86 microarchitecture, a large 64-kbyte level-one cache (32-kbyte dual-ported data cache, 32-kbyte instruction cache with predecode data), and a powerful ieee 754-compatible and 854-compatible floating-point execution unit. in addition, the mobile amd-k6-2-p incorporates a number of new features, including a superscalar mmx unit, support for a 100-mhz frontside bus, and amds innovative 3dnow! technology for high-performance multimedia and 3d graphics operation.
100 mobile amd-k6 ? -2-p processor chapter 12 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information the mobile amd-k6-2-p processor includes several key features for the mobile market. the processor is implemented using an amd-developed, state-of-the-art low power 0.25-micron process technology. this process technology features a split-plane design that allows the processor core to operate at a lower voltage while the i/o portion operates at the industry-standard 3.3v level. in addition, the mobile amd-k6-2-p processor includes the complete industry-standard system management mode (smm), which is critical to system resource and power management. the mobile amd-k6-2-p processor also features the industry-standard stop-clock (stpclk#) control circuitry and the halt instruction, both required for implementing the acpi power management specification. the mobile amd-k6-2-p processor is offered in a standard socket 7-compatible, 321-pin ceramic pin grid array (cpga) package. the mobile amd-k6-2-p processors risc86 microarchitecture is a decoupled decode/execution superscalar design that implements state-of-the-art design techniques to achieve leading-edge performance. advanced design techniques implemented in the mobile amd-k6-2-p processor include multiple x86 instruction decode, single-clock internal risc operations, ten execution units that support superscalar operation, out-of-order execution, data forwarding, speculative execution, and register renaming. in addition, the processor supports the industrys most advanced branch prediction logic by implementing an 8192-entry branch history table, the industrys only branch target cache, and a return address stack, which combine to deliver better than a 95% prediction rate. these design techniques enable the mobile amd-k6-2-p to issue, execute, and retire multiple x86 instructions per clock, resulting in excellent scaleable performance. amds 3dnow! technology is an instruction set extension to x86, that includes 21 new instructions to improve 3d graphics operations and other single precision floating- point compute intensive operations. amd has already shipped millions of amd-k6-2 processors with 3dnow! technology for desktop pcs, revolutionizing the 3d experience with up to four times the peak floating-point performance of previous generation solutions. amd is now bringing this advanced capability to notebook computing, working in conjunction with advanced mobile 3d graphic controllers to reach new levels of realism in mobile computing. with support from microsoft ? and the x86 software developer community, a new generation of visually compelling applications is coming to market that support the 3dnow! technology. the mobile amd-k6-2-p processor remains pin compatible with existing socket 7 notebook solutions, however for maximum system performance, the processor works optimally in newer super7 designs that incorporate advanced features such as support for the 100-mhz frontside bus and agp graphics. the mobile amd-k6-2-p processor has undergone extensive testing and is compatible with windows ? 98, windows nt ? and other leading operating systems. the mobile amd-k6-2-p processor is also compatible with more than 60,000 software applications, including the latest 3dnow! technology and mmx technology software. as the worlds second-largest supplier of processors for the windows environment,
chapter 12 mobile amd-k6 ? -2-p processor 101 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information amd has shipped more than 50 million microsoft windows compatible processors in the last five years. the mobile amd-k6-2-p processor is the next generation in a long line of microsoft windows compatible processors from amd. with its combination of state-of-the-art features, leading-edge performance, high-performance multimedia engine, x86 compatibility, and low-cost infrastructure, the mobile amd-k6-2-p processor delivers unparalleled price/performance for a new generation of notebook pcs. 12.1 super7? platform initiative amd and its industry partners are investing in the future of socket 7 with the new super7 platform initiative. the goal of the initiative is to maintain the competitive vitality of the socket 7 infrastructure through a series of planned enhancements, including the development of an industry-standard 100-mhz processor bus protocol. in addition to the 100-mhz processor bus protocol, the super7 initiative includes the introduction of chipsets that support the agp specification, and support for a backside l2 cache and frontside l3 cache. super7? platform enhancements: n 100-mhz processor bus the mobile amd-k6-2-p processor supports a 100-mhz, 800 mbyte/second frontside bus to provide a high-speed interface to super7 platform-based chipsets. the 100-mhz interface to the frontside level 2 (l2) cache and main system memory speeds up access to the frontside cache and main memory by 50 percent over the 66-mhz socket 7 interfaceresulting in a significant increase of 10% in overall system performance. n accelerated graphics port support agp improves the performance of mid-range pcs that have small amounts of video memory on the graphics card. the industry-standard agp specification enables a 133-mhz graphics interface and will scale to even higher levels of performance. n support for backside l2 and frontside l3 cache the super7 platform has the headroom to support higher-performance amd-k6 processors, with clock speeds scaling to 500 mhz and beyond. future versions of the amd-k6 processor are planned to feature a full-speed, on-chip backside 256-kbyte l2 cache designed to deliver new levels of system performance to notebook pc systems. these versions of the processor are also planned to support an optional 100-mhz frontside l3 cache for even higher-performance system configurations.
102 mobile amd-k6 ? -2-p processor chapter 12 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information
chapter 13 electrical data 103 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 13 electrical data 13.1 operating ranges the mobile amd-k6-2-p processor is designed to provide functional operation if the voltage and temperature parameters are within the limits defined in table 32. table 32. operating ranges parameter minimum typical maximum comments v cc2 1.9 v 2.0 v 2.1 v note 1, 2 2.0 v 2.1 v 2.2 v note 1, 3 2.1 v 2.2 v 2.3 v note 1, 4 v cc3 3.135 v 3.3 v 3.6 v note 1 t case 0 c 80 c note: 1. v cc2 and v cc3 are referenced from v ss . 2. v cc2 specification for 2.0 v component. 3. v cc2 specification for 2.1 v component. 4. v cc2 specification for 2.2 v component.
10 4 electrical data chapter 13 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information 13.2 absolute ratings the mobile amd-k6-2-p processor is not designed to be operated beyond the operating ranges listed in table 32. exposure to conditions outside these operating ranges for extended periods of time can affect long-term reliability. permanent damage can occur if the absolute ratings listed in table 33 are exceeded. table 33. absolute ratings parameter minimum maximum comments v cc2 C0.5 v 2.4 v note 1 C0.5 v 2.6 v note 2 v cc3 C0.5 v 3.6 v v pin C0.5 v v cc3 + 0.5 v and < 4.0 v note 3 t case (under bias) C65 c +110 c t storage C65 c +150 c note: 1. v cc2 specification for 2.0 v and 2.1 v components. 2. v cc2 specification for 2.2 v components. 3. v pin (the voltage on any i/o pin) must not be greater than 0.5 v above the voltage being applied to v cc3 . in addition, the v pin voltage must never exceed 4.0 v.
chapter 13 electrical data 105 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 13.3 dc characteristics the dc characteristics of the mobile amd-k6-2-p processor are shown in table 34. table 34. dc characteristics symbol parameter description preliminary data comments min max v il input low voltage C0.3 v +0.8 v v ih input high voltage 2.0 v v cc3 +0.3v note 1 v ol output low voltage 0.4 v i ol = 4.0-ma load v oh output high voltage 2.4 v i oh = 3.0-ma load i cc2 2.0 v power supply current 8.00 a 400 mhz, note 2, 9,11 475 mhz, note 2,10 2.1 v power supply current 8.50 a 433 mhz, note 3,12 450 mhz, note 3,11 10.50 a 500 mhz, note 3,11 2.2 v power supply current 8.00 a 350 mhz, note 4,11 366 mhz, note 4, 9 380 mhz, note 4,10 400 mhz, note 4, 9,11 notes: 1. v cc3 refers to the voltage being applied to v cc3 during functional operation. 2. v cc2 = 2.1 v the maximum power supply current must be taken into account when designing a power supply. 3. v cc2 = 2.2 v the maximum power supply current must be taken into account when designing a power supply. 4. v cc2 = 2.3 v the maximum power supply current must be taken into account when designing a power supply. 5. v cc3 = 3.6 v the maximum power supply current must be taken into account when designing a power supply. 6. refers to inputs and i/o without an internal pullup resistor and 0 v in v cc3. 7. refers to inputs with an internal pullup and v il = 0.4 v. 8. refers to inputs with an internal pulldown and v ih = 2.4 v. 9. this specification applies to components using a clk frequency of 66 mhz. 10. this specification applies to components using a clk frequency of 95 mhz. 11. this specification applies to components using a clk frequency of 100 mhz. 12. this specification applies to components using a clk frequency of 96.2 mhz.
10 6 electrical data chapter 13 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information i cc3 3.3 v power supply current 0.60 a 350 mhz, note 5,11 0.60 a 366 mhz, note 5, 9 0.61 a 380 mhz, note 5,10 0.62 a 400 mhz, note 5, 9,11 0.64 a 433 mhz, note 5,12 0.66 a 450 mhz, note 5,11 0.67 a 475 mhz, note 5,10 0.69 a 500 mhz, note 5,11 i li input leakage current 15 m a note 6 i lo output leakage current 15 m a note 6 i il input leakage current bias with pullup C400 m a note 7 i ih input leakage current bias with pulldown 200 m a note 8 c in input capacitance 10 pf c out output capacitance 15 pf c out i/o capacitance 20 pf c clk clk capacitance 10 pf c tin test input capacitance (tdi, tms, trst#) 10 pf c tout test output capacitance (tdo) 15 pf c tck tck capacitance 10 pf table 34. dc characteristics (continued) symbol parameter description preliminary data comments min max notes: 1. v cc3 refers to the voltage being applied to v cc3 during functional operation. 2. v cc2 = 2.1 v the maximum power supply current must be taken into account when designing a power supply. 3. v cc2 = 2.2 v the maximum power supply current must be taken into account when designing a power supply. 4. v cc2 = 2.3 v the maximum power supply current must be taken into account when designing a power supply. 5. v cc3 = 3.6 v the maximum power supply current must be taken into account when designing a power supply. 6. refers to inputs and i/o without an internal pullup resistor and 0 v in v cc3. 7. refers to inputs with an internal pullup and v il = 0.4 v. 8. refers to inputs with an internal pulldown and v ih = 2.4 v. 9. this specification applies to components using a clk frequency of 66 mhz. 10. this specification applies to components using a clk frequency of 95 mhz. 11. this specification applies to components using a clk frequency of 100 mhz. 12. this specification applies to components using a clk frequency of 96.2 mhz.
chapter 13 electrical data 107 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 13.4 power dissipation table 35 contains the typical and maximum power dissipation of the 2.2 v mobile amd-k6-2-p processor during normal and reduced power states. table 35. power dissipation (2.2 v components) clock control state 350 mhz 7 366 mhz 5 380 mhz 6 400 mhz 8 comments design power 16.00 w 16.00 w note 1 application power 12.60 w 12.60 w note 2 stop grant / halt (maximum) 2.56 w 3.00 w note 3 stop clock (maximum) 2.25 w 2.70 w note 4 notes: 1. design power represents the maximum sustained power dissipated while executing software or instruction sequences under normal system operation with v cc2 = 2.2 v and v cc3 = 3.3 v. thermal solutions must use thermal feedback to limit the processors peak power. specified through characterization. 2. application power represents the average power dissipated while executing software or instruction sequences under normal system operation with v cc2 = 2.2 v and v cc3 = 3.3 v. 3. the clk signal and the internal pll are still running but most internal clocking has stopped. 4. the clk signal, the internal pll, and all internal clocking has stopped. 5. this specification applies to components using a clk frequency of 66 mhz. 6. this specification applies to components using a clk frequency of 95 mhz. 7. this specification applies to components using a clk frequency of 100 mhz. 8. this specification applies to components using a clk frequency of 66 mhz or 100 mhz.
10 8 electrical data chapter 13 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information table 36 contains the typical and maximum power dissipation of the 2.0v and 2.1v mobile amd-k6-2-p processors during normal and reduced power states. table 36. power dissipation (2.0 v and 2.1 v components) clock control state 400 mhz 5,7 433 mhz 8 450 mhz 7 475 mhz 6 500 mhz 7 comments design power 16.00 w 20.00 w note 1 application power 12.60 w 15.80 w note 2 stop grant / halt (maximum) 2.56 w 2.56 w note 3 stop clock (maximum) 2.25 w 2.25 w note 4 notes: 1. design power represents the maximum sustained power dissipated while executing publicly-available software or instruction sequences under normal system operation with v cc2 = 2.0 v (for 2.0 v components) or v cc2 = 2.1 v (for 2.1 v components) and v cc3 = 3.3 v. thermal solutions must use thermal feedback to limit the processors peak power. specified through characterization. 2. application power represents the average power dissipated while executing publicly-available software or instruction sequence s under normal system operation with v cc2 = 2.0 v (for 2.0 v components) or v cc2 = 2.1 v (for 2.1 v components) and v cc3 = 3.3 v. 3. the clk signal and the internal pll are still running but most internal clocking has stopped. 4. the clk signal, the internal pll, and all internal clocking has stopped. 5. this specification applies to components using a clk frequency of 66 mhz. 6. this specification applies to components using a clk frequency of 95 mhz. 7. this specification applies to components using a clk frequency of 100 mhz. 8. this specification applies to components using a clk frequency of 96.2 mhz.
chapter 13 electrical data 10 9 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 13.5 power and grounding power connections the mobile amd-k6-2-p processor is a dual voltage device. two separate supply voltages are required: v cc2 and v cc3 . v cc2 provides the core voltage for the mobile amd-k6-2-p processor and v cc3 provides the i/o voltage. see electrical data on page 103 for the value and range of v cc2 and v cc3 . there are 28 v cc2 , 32 v cc3 , and 68 v ss pins on the mobile amd-k6-2-p processor. (see pin description diagrams on page 89 for all power and ground pin designations.) the large number of power and ground pins are provided to ensure that the processor and package maintain a clean and stable power distribution network. for proper operation and functionality, all v cc2 , v cc3 , and v ss pins must be connected to the appropriate planes in the circuit board. the power planes have been arranged in a pattern to simplify routing and minimize crosstalk on the circuit board. the isolation region between two voltage planes must be at least 0.254mm if they are in the same layer of the circuit board. (see figure 29 on page 110.) in order to maintain low-impedance current sink and reference, the ground plane must never be split. although the mobile amd-k6-2-p processor has two separate supply voltages, there are no special power sequencing requirements. the best procedure is to minimize the time between which v cc2 and v cc3 are either both on or both off.
110 electrical data chapter 13 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information figure 29. suggested component placement decoupling recommendations in addition to the isolation region mentioned in power connections on page 109, adequate decoupling capacitance is required between the two system power planes and the ground plane to minimize ringing and to provide a low-impedance path for return currents. suggested decoupling capacitor placement is shown in figure 29. surface mounted capacitors should be used as close as possible to the processor to minimize resistance and inductance in the lead lengths while maintaining minimal height. for recommendations regarding the value, quantity, and location of the capacitors illustrated in figure 29, see the mobile amd-k6 ? processor power supply application note , order# 22495. v cc2 (core) plane v cc3 (i/o) plane 0.254mm (min.) for isolation region c1 cc5 cc3 c2 + + + + c5 c6 c7 c8 c9 c10 c17 c18 c19 c20 c21 c22 c23 c24 c25 c26 c27 c28 c29 c30 c31 cc4 + cc6 c14 c15 c16 cc9 cc7 cc10 cc8
chapter 13 electrical data 111 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information pin connection requirements for proper operation, the following requirements for signal pin connections must be met: n do not drive address and data signals into large capacitive loads at high frequencies. if necessary, use buffer chips to drive large capacitive loads. n leave all nc (no-connect) pins unconnected. n unused inputs should always be connected to an appropriate signal level. ? active low inputs that are not being used should be connected to v cc3 through a 20k-ohm pullup resistor. ? active high inputs that are not being used should be connected to gnd through a pulldown resistor. n reserved signals can be treated in one of the following ways: ? as no-connect (nc) pins, in which case these pins are left unconnected ? as pins connected to the system logic as defined by the industry-standard super7 and socket 7 interface ? any combination of nc and socket 7 pins n keep trace lengths to a minimum.
112 electrical data chapter 13 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information
chapter 14 thermal design 113 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 14 thermal design 14.1 package thermal specifications the mobile amd-k6-2-p processor operating specifications call for the case temperature (t c ) to be in the range of 0c to 80c. the ambient temperature (t a ) is not specified as long as the case temperature is not violated. the case temperature must be measured on the top center of the package. table 37 shows the mobile amd-k6-2-p processor thermal specifications. figure 30 on page 113 shows the thermal model of a processor with a passive thermal solution. the case-to-ambient temperature (t ca ) can be calculated from the following equation: t ca = p max ? q ca = p max ? ( q if + q sa ) where: p max = maximum power consumption q ca = case-to-ambient thermal resistance q if = interface material thermal resistance q sa = sink-to-ambient thermal resistance figure 30. thermal model table 37. package thermal specifications t c case temperature maximum design power 2.0 v, 2.1 v, and 2.2 v components 350 mhz 366 mhz 380 mhz 400 mhz 433 mhz 450 mhz 475 mhz 500 mhz 0c C 80c 16.00 w 20.00 w heat exchange device temperature (ambient) case sink t ca thermal q sa q ca q if (c/w) resistance
114 thermal design chapter 14 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information figure 31 illustrates the case-to-ambient temperature (t ca ) in relation to the power consumption (x-axis) and the thermal resistance (y-axis). if the power consumption and case temperature are known, the thermal resistance ( q ca ) requirement can be calculated for a given ambient temperature (t a ) value. figure 31. power consumption versus thermal resistance the thermal resistance of a heatsink is determined by the heat dissipation surface area, the material and shape of the heatsink, and the airflow volume across the heatsink. in general, the larger the surface area the lower the thermal resistance. the required thermal resistance of a heatsink ( q sa ) can be calculated using the following example: if: t c = 80c t a = 55c p max = 20.00w at 500mhz 0.0 1.0 2.0 3.0 4.0 5.0 6.0 6 w 9 w 12 w 15 w 18 w power consumption (watts) thermal resistance (c/w) 30 c 25 c 20 c 15 c t ca t ca = t c - t a
chapter 14 thermal design 115 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information then: thermal grease is recommended as interface material because it provides the lowest thermal resistance (approx. 0.20c/w). the required thermal resistance ( q sa ) of the heat sink in this example is calculated as follows: q sa = q ca C q if = 1.25 C 0.20 = 1.05 (c/w) heat dissipation path figure 32 illustrates the heat dissipation path of the processor. due to the lower thermal resistance between the processor die junction and case, most of the heat generated by the processor is transferred from the top surface of the case. the small amount of heat generated from the bottom side of the processor where the processor socket blocks the convection can be safely ignored. figure 32. processors heat dissipation path measuring case temperature the processor case temperature is measured to ensure that the thermal solution meets the processors operational specification. this temperature should be measured on the top center of the package where most of the heat is dissipated. figure 33 shows the correct location for measuring the case temperature. if a heatsink is installed while measuring, the thermocouple must be installed into the heatsink via a small hole drilled through the heatsink base (for example, 1/16 of an inch). the thermocouple is then attached to the base of the heatsink and the small hole filled using thermal epoxy, allowing q ca t c t a C p max ------------------ - ? ?? 25 c 20.0w ----------------- - 1.25 cw () == thin lid case temperature ambient temperature
116 thermal design chapter 14 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information the tip of the thermocouple to touch the top of the processor case. figure 33. measuring case temperature for more information on thermal design considerations, see the amd-k6 ? thermal solution design application note , order# 21085. thermocouple thermally conductive epoxy
chapter 15 ordering information 117 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information 15 ordering information standard amd-k6-2-p products amd mobile performance products are available in several operating ranges. the ordering part number (opn) is formed by a combination of the elements below. table 38. valid ordering part number combinations opn package type operating voltage case temperature amd-k6-2/500adk 321-pin cpga 2.0vC2.2v (core) 3.135vC3.6v (i/o) 0cC80c (cpga) amd-k6-2/475ack 321-pin cpga 1.9vC2.1v (core) 3.135vC3.6v (i/o) 0cC80c (cpga) amd-k6-2/450adk 321-pin cpga 2.0vC2.2v (core) 3.135vC3.6v (i/o) 0cC80c (cpga) note: this table lists configurations planned to be supported in volume for this device. consult the local amd sales office to confirm availability of specific valid combinations and to check on newly-released combinations. a amd-k6-2 package type family/core a = 321-pin cpga amd-k6-2 case temperature k = 0cC80c /500 performance rating /500 /400 operating voltage c = 1.9 vC2.1 v (core) / 3.135 vC3.6 v (i/o) d = 2.0 vC2.2 v (core) / 3.135 vC3.6 v (i/o) f = 2.1 vC2.3 v (core) / 3.135 vC3.6 v (i/o) d k /475 /380 /450 /366 /433 /350
118 ordering information chapter 15 mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information amd-k6-2/433adk 321-pin cpga 2.0vC2.2v (core) 3.135vC3.6v (i/o) 0cC80c (cpga) amd-k6-2/400ack 321-pin cpga 1.9vC2.1v (core) 3.135vC3.6v (i/o) 0cC80c (cpga) amd-k6-2/400afk 321-pin cpga 2.1vC2.3v (core) 3.135vC3.6v (i/o) 0cC80c (cpga) amd-k6-2/380afk 321-pin cpga 2.1vC2.3v (core) 3.135vC3.6v (i/o) 0cC80c (cpga) amd-k6-2/366afk 321-pin cpga 2.1vC2.3v (core) 3.135vC3.6v (i/o) 0cC80c (cpga) amd-k6-2/350afk 321-pin cpga 2.1vC2.3v (core) 3.135vC3.6v (i/o) 0cC80c (cpga) table 38. valid ordering part number combinations (continued) opn package type operating voltage case temperature note: this table lists configurations planned to be supported in volume for this device. consult the local amd sales office to confirm availability of specific valid combinations and to check on newly-released combinations.
index 119 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information index numerics 100-mhz bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 , 101 input setup and hold timings. . . . . . . . . . . . . . . . . . . . . . . 58 321-pin staggered cpga package specification . . . . . . . . . . . . . . . . . . . . . . .83 C 84 , 86 pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 360-pin cbga package specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 3dnow! technology . . . . . . . . . . . . . . . . . . . . 9 , 11 C 12 , 15 C 19 execution unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 C 19 register operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 66-mhz bus clock switching characteristics . . . . . . . . . . . . . . . . . . . . . 54 input setup and hold timings. . . . . . . . . . . . . . . . . . . . . . . 62 output delay timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 a accelerated graphic port (agp) . . . . . . . . . . . . . . . . . . . 5 , 101 address stack, return . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 address bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 , 28 agp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 C 5 , 100 C 101 architecture internal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 C 21 b bits, predecode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 boundary-scan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 branch execution unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 history table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 prediction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 , 11 , 21 , 99 prediction logic . . . . . . . . . . . . . . . . . . . 3 C 4 , 19 C 20 , 99 C 100 target cache . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 bus 100-mhz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 , 101 address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 , 28 cycle definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 C 28 , 32 c cache . . . . . . . . . . . . . . . . . . . . . . . 3 C 5 , 11 , 23 , 25 , 27 C 31 , 33 , . . . . . . . . . . . . . . . . . . . . . . . 35 C 36 , 40 , 56 , 60 , 99 C 101 branch target . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 writeback . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 , 11 case temperature . . . . . . . . . . . . 79 C 80 , 82 , 95 , 113 C 116 , 118 cbga mechanical specification . . . . . . . . . . . . . . . . . . . . . . 87 centralized scheduler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 clk waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 clock control state diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 states halt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 stop clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 stop grant . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 stop grant inquire . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 component placement . . . . . . . . . . . . . . . . . . . . . . . . . 76 , 110 control unit, scheduler/instruction . . . . . . . . . . . . . . . . . . . . . . . . 10 cycles inquire. . . . . . . . . . . . . . . . . . . . . . . . . .25 C 26 , 28 C 29 , 37 C 40 interrupt acknowledge . . . . . . . . . . . . . . . . . . . . . 27 , 33 , 36 pipelined. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 special . . . . . . . . . . . . . . . . . . . . . . . . . 29 , 32 , 36 , 38 C 39 , 48 writeback . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 , 40 C 41 d data bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 C 28 , 32 decode, instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 decoders . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 , 9 , 99 dual voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 , 109 e electrical specifications absolute ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 , 104 operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 , 103 exception . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 C 29 , 50 C 51 debug. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 floating-point . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 exceptions, interrupts, and debug in smm . . . . . . . . . . . . 51 execution units. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 , 99 execution unit 3dnow! . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 , 18 C 19 branch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 , 16 , 21 floating-point . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 , 16 load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 , 16 multimedia . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 , 16 , 18 C 19 register x . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 , 16 , 18 C 19 register y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 , 16 , 18 C 19 store. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 , 16 execution units . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 C 10 , 17 f fetch, instruction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 float delay timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 floating-point exception . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 frequency . . . . . . . . . . . . . . . . 26 , 41 , 54 , 66 , 72 , 74 , 105 , 107 functional unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 multimedia . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 h halt restart slot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 state. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
120 index mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information heat dissipation path. . . . . . . . . . . . . . . . . . . . . . . . . . . 81 , 115 history table, branch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 hold acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 , 68 i i/o trap dword . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 C 49 trap restart slot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 ieee 1149.1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 , 33 , 99 ignore numeric exception . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 input pin types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 setup and hold timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 input setup and hold timings for 100-mhz bus operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 input/output pin float conditions . . . . . . . . . . . . . . . . . . . . 35 inquire cycles . . . . . . . . . . . . . . . . . . . . . 25 C 26 , 28 C 29 , 37 C 40 instruction decode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 fetch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 prefetch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 instructions emms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 femms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 prefetch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 internal architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 C 21 interrupt . . . . . . . . . . . . . . . . . . 27 , 30 C 33 , 36 , 40 , 42 , 44 , 51 acknowledge cycles. . . . . . . . . . . . . . . . . . . . . . . . 27 , 33 , 36 service routine. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 system management . . . . . . . . . . . . . . . . . . . . . . . 32 , 42 , 44 j jtag. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 , 33 l logic branch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 branch-prediction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 C 20 logic, branch-prediction . . . . . . . . . . . . . . . . . . . . . . . . . 4 , 100 m mesi. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 , 12 , 99 bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 microarchitecture . . . . . . . . . . . . . . . . . . . . . . . . . .3 C 4 , 99 C 100 enhanced risc86 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 overview, amd-k6-2 processor . . . . . . . . . . . . . . . . . . . . . . 7 mmx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 , 5 , 30 C 31 , 99 C 100 mmx technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 C 19 register operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 multimedia execution unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 C 19 functional unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 o operating ranges . . . . . . . . . . . . . . . 53 , 71 , 95 , 103 C 104 , 117 opn . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 , 117 C 118 ordering part number (opn). . . . . . . . . . . . . . . . . . . . 95 , 117 output pin float conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 valid delay timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 p parity. . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 , 25 C 26 , 28 , 31 , 93 bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 , 28 check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 , 31 part number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 , 117 C 118 pin connection requirements . . . . . . . . . . . . . . . . . . . 77 , 111 pipeline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 register x and y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 six-stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 , 10 pipelined. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 , 18 , 30 cycles. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 pipelined cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 power and grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 , 110 connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 , 109 dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 , 114 predecode bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 C 12 prefetching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 r register x. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 execution unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 register x and y pipelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 register y. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 execution unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 , 30 C 31 , 44 , 50 x and y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 C 18 reset and configuration timing . . . . . . . . . . . . . . . . . . . . . 69 return address stack . . . . . . . . . . . . . . . . . . . . . . . . 4 , 20 , 100 risc86 microarchitecture . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 rsm instruction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 , 50 s scheduler centralized . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 instruction control unit . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 signal descriptions a[31:3]. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 a20m# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 , 42 ads# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 adsc#. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 ahold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 , 38 ap . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 apchk# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 be[7:0]# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 bf[2:0]. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 , 41 boff# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 , 38 brdy#. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 , 38 C 39 , 49 brdyc# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 breq. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
index 121 21896e/0may 2000 mobile amd-k6 ? -2 processor data sheet preliminary information cache# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 clk . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 , 37 , 39 C 41 , 53 C 54 d/c# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 d[63:0] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 dp[7:0] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 eads# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 , 40 ewbe# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 , 38 C 39 ferr# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 flush# . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 , 36 , 38 C 39 , 51 hit# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 , 40 hitm# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 , 40 hlda . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 hold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 , 38 ignne# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 init . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 , 38 C 39 , 43 intr. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 , 38 C 39 inv . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 ken# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 lock# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 m/io# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 na#. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 nmi. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 , 38 C 39 , 43 , 51 pchk# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 pwt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 , 38 C 39 , 41 , 53 rsvd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 scyc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 smi# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 , 38 C 39 , 42 , 49 smiact# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 , 42 stpclk# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 , 37 , 39 C 40 tck . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 , 53 tdi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 tdo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 tms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 trst# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 vcc2det . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 vcc2h/l# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 w/r#. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 wb/wt# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 single instruction multiple data (simd). . . . . . . . . . . . . . . 11 smm base address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 default register values . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 initial state of registers . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 operating mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 revision identifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 state-save area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 special bus cycle . . . . . . . . . . . . . . . . . . 29 , 32 , 36 , 38 C 39 , 48 stack, return address. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 stop clock state. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 grant inquire state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 grant state. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 super7 platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 , 101 initiative . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 , 101 switching characteristics 66-mhz bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 input setup and hold timings for 100-mhz bus . . . . . . . . 58 t table, branch history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 tap . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 target cache, branch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 tck waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 , 70 temperature . . . . . 71 , 79 C 80 , 82 , 87 , 95 , 103 , 113 C 116 , 118 case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 C 80 , 113 C 114 test access port (tap) tck . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 tdi. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 tdo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 tms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 trst# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 test pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 test signal timing at 25 mhz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 thermal. . . . . . . . . . . . . . . . . . . . 74 , 79 C 82 , 87 , 107 , 113 C 116 model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 model (cbga package) . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 , 114 specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 , 113 trst timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 , 70 tsc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 C 39 v voltage . . . . . . . . . . . . . . . . . . 3 C 4 , 23 , 33 , 37 , 53 , 71 C 72 , 75 , . . . . . . . . . . . . . . . . . . . 95 , 99 C 100 , 103 C 105 , 109 , 118 dual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 , 109 w writeback . . . . . . . . . . . . . . . .3 , 27 , 29 , 31 , 33 , 36 , 40 C 41 , 99 cache . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 , 11 cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 , 40 C 41
122 index mobile amd-k6 ? -2 processor data sheet 21896e/0may 2000 preliminary information

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